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12篇 您的检索式:作者名="C.M. Cheng"
    题名 作者 年代 出处 被引量
1Butt-welding Residual Stress of Heat Treatable Aluminum Alloys显示文摘这研究,拿三作为试验性的材料铝合金 2024-T351,6061-T6 and7075-T6 打字,进行的单个V沟 GTAW (煤气的钨 arcwelding )焊接靶子在不同单个V沟角度并且在在 thethree 铝合金强调分析并且比较剩余的大小和差别制止或 unrestrainedconditions.The 结果证明靶子关节的更大的投出角度,更高 residualtensile stress.Too 小投出角度将导致戏剧的C.M. Cheng 2007Journal of Materials Science & Technology2007,23,2:4
2Hot Cracking in AZ31 and AZ61 Magnesium Alloy显示文摘This paper examined the impact of the number of thermal cycles and augmented strain on hot cracking in AZ31 and AZ61 magnesium alloy. Statistical analyses were performed. Following observation using a scanning electron microscope (SEM), an energy dispersive spectrometer (EDS) was used for component analysis. Results showed that Al content in magnesium alloy has an effect on hot cracking susceptibility. In addition, the nonequilibrium solidification process produced segregation in Al content, causing higher liquid Mg-alloy rich Al content at grain boundaries, and resulting into liquefied grain boundaries of partially melted zone (PMZ). In summary, under multiple thermal cycles AZ61 produced serious liquation cracking. AZ61 has higher (6 wt%) Al content and produced much liquefied Mg17Al12 at grain boundaries under multiple thermal cycles. The liquefied Mg17Al12 were pulled apart and hot cracks formed at weld metal HAZ due to the augmented strain. Since AZ31 had half the Al content of AZ61, its hot-cracking susceptibility was lower than AZ61. In addition, AZ61 showed longer total crack length (TCL) in one thermal cycle compared to that in three thermal cycles. This phenomenon was possibly due to high-temperature gasification of Al during the welding process, which resulted in lower overall Al content. Consequently, shorter hot cracks exhibited in three thermal cycles. It was found the Al content of AZ31 and AZ61 can be used to assess the hot-cracking susceptibility.C.J. Huang C.M. Cheng C.P. Chou F.H. Chen 2011Journal of Materials Science & Technology2011,27,7:3
3Mechanical properties of bilayer graphene sheets coupled by sp 3 bonding显示文摘Y.Y. Zhang C.M. Wang Y. Cheng Y. Xiang 2011Carbon2011,,13:1
4A study of the relationship between competitiveness and technological innovation capability based on DEA models显示文摘Jian Cheng Guan Richard C.M. Yam Chiu Kam Mok Ning Ma 2004European Journal of Operational Research2004,,3:1
5Biodegradation of phthalate esters by two bacteria strains显示文摘B.V. Chang C.M. Yang C.H. Cheng S.Y. Yuan 2003Chemosphere2003,,4:1
6An audit of technological innovation capabilities in chinese firms: some empirical findings in Beijing, China显示文摘Richard C.M. Yam Jian Cheng Guan Kit Fai Pun Esther P.Y. Tang 2004Research Policy2004,,8:1
7A study of the relationship between competitiveness and technological innovation capability based on DEA models显示文摘Jian Cheng Guan Richard C.M. Yam Chiu Kam Mok Ning Ma 2004European Journal of Operational Research2004,,3:1
8Technology transfer and innovation performance: Evidence from Chinese firms显示文摘Jian Cheng Guan Chiu Kam Mok Richard C.M. Yam K.S. Chin Kit Fai Pun 2005Technological Forecasting & Social Change2005,,6:1
9An audit of technological innovation capabilities in chinese firms: some empirical findings in Beijing, China显示文摘Richard C.M. Yam Jian Cheng Guan Kit Fai Pun Esther P.Y. Tang 2004Research Policy2004,,8:1
10A study of the relationship between competitiveness and technological innovation capability based on DEA models显示文摘Jian Cheng Guan Richard C.M. Yam Chiu Kam Mok Ning Ma 2004European Journal of Operational Research2004,,3:1
11A study of the relationship between competitiveness and technological innovation capability based on DEA models显示文摘Jian Cheng Guan Richard C.M. Yam Chiu Kam Mok Ning Ma 2004European Journal of Operational Research2004,,3:1
12拉曼散射研究微尺寸圆锥形状的GeSi合金薄膜的应力(英文)显示文摘We present the micro-Raman study of curved Ge_xSi_ 1-x/Ge_ySi_ 1-y heterostructure, and found the strain of the curved thin layer is proportional to the curvature, i.e. inversely proportional to the diameter.C.M. Lin C.T. Chia V. I. Mashanov H.H. Cheng 2005光散射学报2005,17,3:0
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