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| 1 | Reliability Model for AI Wire Bonds subjected to Heel Crack Failures显示文摘 | RAMMINGER S SELIGER N Wachutka G | 2000 | Microelectronics Reliability2000，40，： | 1 |
| 2 | Reliability model for A1 wire bonds subjected to heel crack failures显示文摘 | Ramminger S Seliger N Wachutka G | 2000 | Microelectronics Reliability2000，40，8： | 1 |
| 3 | Reliability model for Al wire bonds subjected to heel crack failures显示文摘 | RAMMINGER S SELIGER N WACHUTKA G | 2000 | Microelectronics Reliability2000，40，9： | 1 |
| 4 | Reliability model for Al wire bonds subjected to heel crack failures显示文摘 | Ramminger S Seliger N Wachutka G | 2000 | Microelectroni s Reliability2000，40，： | 1 |
| 5 | Reliability model for Al wire bonds subjected to heel crack failures显示文摘 | RAMMINGER S SELIGER N WACHUTKA G | 2000 | Microelectronics Reliability2000，40，10： | 1 |
| 6 | Reliability model for A1 wire bonds subjected to heel crack failures 显示文摘 | Ramminger S Seliger N Wachutka G | 2000 | Microelectronics Reliability2000，40，9： | 1 |
| 7 | Methodology for planning and operating energy-efficient production systems显示文摘 | WE1NERT N CHIOTELLIS S SELIGER G | 2011 | CIRP Annals - Manufacturing Technology2011，60，1： | 1 |
| 8 | Reliability model for Al wire bonds subjected to heel crack failures显示文摘 | RAMMINGER S SELIGER N WACHUTKA G | 2000 | Microelectronics Reliability2000，40，8： | 1 |
| 9 | Reliability model for A1 wire bonds subjected to heel crack failures 显示文摘 | Ramminger S Seliger N | 2000 | Microelectron Reliab2000，40，： | 1 |
| 10 | Reliability model for al wire bonds subjected to heel crack failures显示文摘 | Ramminger S Seliger N Wachutka G | 2000 | Microelectronics Reliability2000，40，： | 1 |
| 11 | 查看详情显示文摘 | Chernick C L Claassen H H Fields P R Hyman H H Malm J G Manning W M Matheson M S Quarterman L A Schreiner F Selig H H Sheft I Siegel S Sloth E N Stein L Studier M H Weeks J L Zirin M H | | 0，，： | 1 |
| 12 | Integral 3-D thermal,electrical and mechanical design of an automotive DC/DC converter显示文摘 | Gerber M Ferreira J A Seliger N | 2005 | IEEE Transactions on Power Electronics2005，20，3： | 1 |
| 13 | Reliability Model for Al Wire Bonds Subjected to Heel Crack Failures显示文摘 | RAMMINGER S SELIGER N WACHUTKA G | 2000 | Microelectronics Reliability2000，40，： | 1 |
| 14 | Reliability model for Al wire bonds subjected to heel crack failures显示文摘 | RAMMINGER S SELIGER N WACHUTKA G | 2000 | Microelectronics Reliability2000，40，8： | 1 |
| 15 | Reliability Model for Al Wire Bonds Subjected to Heel Crack Failures 显示文摘 | Ramminger S Seliger N Wachutka G | 2000 | Microelectronics Relsiability2000，40，： | 1 |
| 16 | 岩石力学与工程学报,冲击荷载作用下饱和软黏土的一些性状[J],Marine Geotechnology,The effect of cyclic loading on the undrained shear strength of a silty clay[J],[9]HYDE A F L,Journal of Geotechnical Engineering,Post-cyclic undrained strength for cohesive soils[J],[8]YASUHARA K,Soils显示文摘 | 方汝林 土壤学报 | | 岩土力学0，，： | 1 |
| 17 | Renal cell carcinoma escapes NK cell-mediated immune surveillance through the downregulation of DNAM-1显示文摘Dear Editor,The activating receptor DNAX accessory molecule-1(DNAM-1)plays an important role in T and natural killer(NK)cell-mediated cytotoxicity via the interaction with its ligands poliovirus receptor(PVR,CD155)and Nectin-2(CD112).Compared with peripheral blood NK cells,tumor-infiltrating NK cells show reduced expression of DNAM-1 across several solid tumors,including ovarian and breast cancer resulting in impaired NK cell function.Early studies reported an inverse correlation between DNAM-1 expression and its ligands in leukemic blasts and ovarian cancer[1]. | Veronika Kremer Shi Yong Neo Yaxuan Liu Yi Chen Arnika Kathleen Wagner Ying Yang Ziqing Chen Christina Seitz Nicholas Patrick Tobin Maarten Alexander Ligtenberg Evren Alici Xinsong Chen Felix Haglund Barbara Seliger Ulrika Harmenberg Eugenia Colón Ann-Helén Scherman Plogell Lisa Lei Liu Andreas Lundqvist | 2023 | Cancer Communications2023，43，7： | 0 |
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