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22篇 您的检索式：作者名="Kripesh"

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	题名	作者	年代	出处	被引量
1	Influence of single-wall carbon nanotube addition on the microstructural and tensile properties of Sn-Pb solder alloy显示文摘	Kumar K Mohan Kripesh V	2008	J Alloys Compd2008，455，：	1
2	Effect of Nd: YAG laser micromachining on gold conductor printed over ceramic substrates 显示文摘	KRIPESH V GUST W BHATNAGAR S K	2000	Materials Letters2000，44，6：	1
3	Fiber misalignment in silicon V-groove based optical modules显示文摘	A. Priyadarshi L.H. Fen S.G. Mhaisalkar V. Kripesh A.K. Asundi	2005	Optical Fiber Technology2005，，2：	1
4	Effect of Electromigration on the Mechanical Performance of Sn-3.5Ag Solder Joints with Ni and Ni-P Metallizations显示文摘	Aditya Kumar Ying Yang Chee C. Wong Vaidhyanathan Kripesh Zhong Chen	2009	Journal of Electronic Materials2009，，1：	1
5	Nanoindentation study of Zn-based Pb free solders used in fine pitch interconnect applications显示文摘	KUMAR K M KRIPESH V SHEN L	2006	Mater Sci Eng A2006，423，1：	1
6	Tensile deformation behavior of nano-sized Mo particles reinforced显示文摘	Rao B S S C Kumar K M Kripesh V	2011	Materials Sci- ence and Engineering A2011，528，12：	1
7	Three-di- mensional system-in-package using stacked silicon platform technology显示文摘	KRIPESH V YOON S W GANESH VP	2005	IEEE Transaction on Advanced Packaging2005，8，3：	1
8	Development of 3-D silicon module with TSV for systemin packaging显示文摘	Khan N Rao V S Lim S We H S Lee V Zhang X W Liao E B Nagarajan R Chai T C Kripesh V Lau JH	2010	IEEE Transactions on Components andPackaging Technologies2010，33，1：	1
9	Synthesis and characterization of patterned and nonpatterned copper and nickel nanowire arrays on silicon substrate显示文摘	Gaurav Sharma Vaidyanathan Kripesh	2007	Sensors and Actuators A: Physical2007，139，12：	1
10	Single-wall carbon nanotube (SWCNT) functionalized Sn-Ag-Cu lead-free composite solders 显示文摘	MohanKumar K Kripesh V	2008	Journal of Alloys and Compounds2008，450，：	1
11	Tensile de formation behavior of nano-sized Mo particles reinforced SnAgCu solders显示文摘	RAOBSSC KUMAR K M KRIPESH V	2011	Materials Science and Engineering:A2011，528，12：	1
12	Influence of single-wall carbon nanotube addition on the microstructural and tensile properties of Sn-Pb solder alloy显示文摘	MOHAN K K KRIPESH V TAY A A O	2008	Journal of Alloys and Compounds2008，455，：	1
13	Board level solder joint reliability analysis of a fine pitch Cu post type wafer level package (WLP) 显示文摘	ZHANG X W KRIPESH V	2008	Microelectron Reliab2008，48，：	1
14	Study on the microstructure and mechanical properties of a novel SWCNT-reinforced solder alloy for ultra-fine pitch applications显示文摘	MOHAN K K KRIPESH V SHEN L	2006	Thin Solid Films2006，504，12：	1
15	Tensile deformation behavior of nano-sized Mo particles reinforced SnAgCu solders显示文摘	Rao B S S C Kumar K M Kripesh V	2011	Materials Science and Engineering A2011，528，12：	1
16	Single-wall carbon nanotube (SWCNT) functionalized Sn-Ag-Cu lead-flee composite solders 显示文摘	K Mohan Kumar V Kripesh B Andrew A O Tay	2006	Journal of Alloys and Compounds2006，10，25：	1
17	Study on the microstructure and mechanical properties of a novel SWCNT-reinforced solder alloy for ultra-fine pitch applications显示文摘	Kumar K M Kripesh V Shen L Tay A A O	2006	Thin Solid Films2006，504，12：	1
18	Synthesis and characterization of patterned and nonpatterned copper and nickel nanowire arrays on silicon substrate显示文摘	SHARMA G KRIPESH V SIM M C	2007	Sensors and Actuators A2007，139，12：	1
19	Tensile deformation behavior of nano-sized Mo particles reinforced SnAgCu solders 显示文摘	Chandra R Mohan K Kripesh V	2011	Materials Science and Engineering2011，528，：	1
20	Single-wall carbon nanotube (SWCNT) functionalized Sn-Ag-Cu lead-free composite solders 显示文摘	Kumar K M Kripesh V Andrew A O	2008	Journal of Alloys and Compound2008，450，：	1

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