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260篇 您的检索式：期刊名="IEEE Transaction on Advanced Packaging"

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	题名	作者	年代	出处	被引量
1	Modeling of simultaneous switching noise in high speed systems显示文摘	Chun S Swaminathan M	2001	IEEE Transactions on Advanced Packaging2001，24，2：	1
2	Power Distribution Networks for System on Package: Status and Challenges 显示文摘	Swaminathan M Kim J Novak 1	2004	IEEE Transactions on Advanced Packaging2004，27，2：	1
3	Direct fabrication of electric components on insulated boards by laser micro-cladding electronic pastes显示文摘	Li X Y Li H L	2006	IEEE transactions on advanced packaging2006，29，2：	1
4	Numerical simulation of the drop impact response of a portable electronic product显示文摘	Teo Y M Shim V P W	2002	IEEE Transactions on Advanced Packaging Technology2002，25，3：	1
5	Optoelectronic and microwave transmission characteristics of indium solder bumps for low-temperature flip-chip applications 显示文摘	Kun-Mo Chu	2006	IEEE Transactions on Advanced Packaging2006，29，3：	1
6	A flexible time-stepping scheme for hybrid field-circuit simulation based on the extended time-simulation based on the extended time- domain finite method 显示文摘	Wang Rui Jin Jianming	2010	IEEE Transactions on Advanced Packaging2010，33，4：	1
7	Chip-level vacuum packaging of micromachines using nanogetters显示文摘	Sparks D R Massoud-Ansari S Najafi N	2003	IEEE Transactions on Advanced Packaging2003，26，3：	1
8	Thermal fatigue of SnPb and SAC resistor joints:analysis of stress-strain as a function of cycle parameters显示文摘	Qi Y Ghorbani H R Speh J K	2006	IEEE Transactions on Advanced Packaging2006，29，4：	1
9	Full-wave Solver for Microstrip Trace and through-hole Via in Layered Media显示文摘	ONG C TSANG L	2008	IEEE Transaction on Advanced Packaging2008，31，8：	1
10	Chip-package Co-implementation of a Triple DES Processor 显示文摘	Glaser S T Franzon A	2004	IEEE Transactions on Advance Packaging2004，27，1：	1
11	Effect of intermetallic compounds on the thermal fatigue of surface mount solder joints显示文摘	Tu P L Chan Y C Lai J K L	1997	IEEE Transactions on Components Packaging and Manufacturing Technology Part B: Advanced Packaging1997，20，1：	1
12	An innovative for packaging power electronics building blocks using metal posts interconnected parallel plate structures显示文摘	Kun X Lin R L	1999	IEEE Transactions on Advanced Packaging1999，22，2：	1
13	Efficient computation of interconnect capacitances using the domain decomposition approach显示文摘	V V Veremey R Mittra	1999	IEEE Transactions on Advanced Packaging1999，22，3：	1
14	Electrical characterization of textile transmission lines显示文摘	COTTET D GRZYB J TRSTER K	2003	Advanced Packaging IEEE Transactions on2003，26，2：	1
15	Chip - level vacuum packaging of micromaehines using nanogetters 显示文摘	Sparks D Massoud - Ansari S Najafi N	2003	IEEE transactions on advanced packaging2003，263，：	1
16	Design and test methodology for an analog-to- digital converter multichip module for experimental all-digital radar receiver operating at 2 gigasamples/s 显示文摘	Thompson R L Amundsen E H Schaefer T M	1999	IEEE Transactions on Advanced Packaging1999，22，4：	1
17	Effect of temperature cycling on joint strength of PbSn and AuSn solders in laser packages显示文摘	KUANG J H SHEEN M T CHANG C F H etal	2001	IEEE Transactions on Advanced Packaging2001，24，2：	1
18	SOP: what is it and why? a new microsystems-integration technology paradigm Moore's law for system integration of miniaturized convergent systems of the next decade 显示文摘	TUMMALA R R	2004	IEEE Transactions on Advanced Packaging2004，27，2：	1
19	Thermal component model for electrothermal analysis of IGBT module systems显示文摘	Yun Chansu Malberti Paolo Ciappa Mauro	2001	IEEE Transactions on Advanced Packaging2001，24，3：	1
20	Thermal component model for electrothermal analysis of IGBT module systems显示文摘	Yun Chan-Su Malberti Paolo Ciappa Mauro	2001	IEEE Transactions on Advanced Packaging2001，24，3：	1

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