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		题名	作者	年代	出处	被引量
	1	Polymorphisms of the vascular endothelial growth factor A gene and susceptibility to sporadic brain arteriovenous malformation in a Chinese population显示文摘	Hongyan Chen Yuxiang Gu Wenting Wu Dan Chen Peiliang Li Weiwei Fan Daru Lu Fan Zhao Nidan Qiao Huijia Qiu Chaowei Fu Ying Mao Yao Zhao	2010	Journal of Clinical Neuroscience2010，，4：	1
	2	Y_(2)O_(3) nanosheets as slurry abrasives for chemical-mechanical planarization of copper显示文摘Continued reduction in feature dimension in integrated circuits demands high degree of flatness after chemical mechanical polishing.Here we report using new yttrium oxide(Y_(2)O_(3))nanosheets as slurry abrasives for chemical-mechanical planarization(CMP)of copper.Results showed that the global planarization was improved by 30%using a slurry containing Y_(2)O_(3) nanosheets in comparison with a standard industrial slurry.During CMP,the two-dimensional square shaped Y_(2)O_(3) nanosheet is believed to induce the low friction,the better rheological performance,and the laminar flow leading to the decrease in the within-wafer-non-uniformity,surface roughness,as well as dishing.The application of the two-dimensional nanosheets as abrasive in CMP would increase the manufacturing yield of integrated circuits.	Xingliang HE Yunyun CHEN Huijia ZHAO Haoming SUN Xinchun LU Hong LIANG	2013	Friction2013，1，4：	1
	3	Flatness maintenance and roughness reduction of silicon mirror in chemical mechanical polishing process显示文摘As an important optical component in laser system,silicon mirror surface is required to have micron-level flatness and subnanometer-level roughness.The research concentrates on how to improve roughness as far as possible while maintaining flatness of silicon mirror surface during chemical mechanical polishing(CMP)process.A polishing edge effect model is established to explain the reason of flatness deterioration,and a roughness theoretical model is set up to get the limit of perfect surface roughness.Based on the models above,a polishing device is designed to maintain the surface flatness,and the optimized polishing process parameters are obtained by orthogonal tests to get a near-perfect surface roughness.Finally the maintenance of flatness and the improvement of roughness can be achieved at the same time in one step of CMP process.This work can be a guide for silicon mirror manufacture to improve optical reflection performance significantly.	JIANG BoCheng ZHAO DeWen WANG BingQuan ZHAO HuiJia LIU YuHong LU XinChun	2020	Science China(Technological Sciences)2020，63，1：	1

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