维普期刊资源整合服务平台（V6.5）

28篇 您的检索式：作者名="WACHUTKA"

选中清除导出查看参考文献查看引证文献引用追踪共2页首页上一页第1页下一页末页 /2 跳转

	题名	作者	年代	出处	被引量
1	Reliability Model for AI Wire Bonds subjected to Heel Crack Failures显示文摘	RAMMINGER S SELIGER N Wachutka G	2000	Microelectronics Reliability2000，40，：	1
2	Reliability model for A1 wire bonds subjected to heel crack failures显示文摘	Ramminger S Seliger N Wachutka G	2000	Microelectronics Reliability2000，40，8：	1
3	Reliability model for Al wire bonds subjected to heel crack failures显示文摘	RAMMINGER S SELIGER N WACHUTKA G	2000	Microelectronics Reliability2000，40，9：	1
4	Reliability model for Al wire bonds subjected to heel crack failures显示文摘	Ramminger S Seliger N Wachutka G	2000	Microelectroni s Reliability2000，40，：	1
5	Rigorous Thermodynamic Treatment of Heat Generation and Conduction in Semiconductor Device Modeling显示文摘	Wachutka G K	1990	IEEE Transactions on Computer-Aided Design1990，9，11：	1
6	Crack mechanism in wire bonding joints显示文摘	RAMMINGER S TUKES P WACHUTKA G		0，，：	1
7	Reliability model for Al wire bonds subjected to heel crack failures显示文摘	S. Ramminger N. Seliger G. Wachutka	2000	Microelectronics Reliability2000，，8：	1
8	Reliability model for A1 wire bonds subjected to heel crack failures显示文摘	RAMMINGER S SELIGERN WACHUTKA G	2000	2000，，：	1
9	Transient Temperature Fields with General Nonlinear Boundary Conditions in Electronic Systems显示文摘	GERSTENMAIER Y C WACHUTKA G K M	2005	Components and Packaging Technologies IEEE Transactions on2005，28，1：	1
10	Crack mechanism in wire bonding joints显示文摘	S. Ramminger P. Türkes G. Wachutka	1998	Microelectronics Reliability1998，，6：	1
11	Reliability model for Al wire bonds subjected to heel crack failures显示文摘	RAMMINGER S SELIGER N WACHUTKA G	2000	Microelectronics Reliability2000，40，10：	1
12	Tailored modeling:a way to the'virtual microtransducer fab'显示文摘	G	1995	Sensors and Actuators A1995，603，：	1
13	Problemoriented modelling of microtransducers:state of the art and future challenges显示文摘		1994	Sensors and Actuators A1994，279，：	1
14	Fabrication and modeling of CMOS microbridge gas-flow sen-sors显示文摘	Lenggenhager R Wachutka G	1992	Sensors and Actuators B1992，6，：	1
15	Reliability model for A1 wire bonds subjected to heel crack failures 显示文摘	Ramminger S Seliger N Wachutka G	2000	Microelectronics Reliability2000，40，9：	1
16	Reliability model for Al wire bonds subjected to heel crack failures显示文摘	RAMMINGER S SELIGER N WACHUTKA G	2000	Microelectronics Reliability2000，40，8：	1
17	Design of ideal cir- cular bending actuators for high performance micropumps 显示文摘	Herz M Horsch D Wachutka G	2010	Sensors and Actuators A : Physical2010，163，1：	1
18	Microfluidic system modeling using VHDL-AMS and circuit simulation显示文摘	VOIGT P SCHRAG G WACHUTKA G	1998	Journal of Microelectronics1998，29，11：	1
19	Rigorous thermodynamic treatment of heat generation in semiconductor device modeling显示文摘	WACHUTKA G K		0，，11：	1
20	Reliability model for al wire bonds subjected to heel crack failures显示文摘	Ramminger S Seliger N Wachutka G	2000	Microelectronics Reliability2000，40，：	1

返回顶部每页显示：

共2页首页上一页第1页下一页末页 /2 跳转

互联网出版许可证新出网证(渝)字10号全国400电话 - 免长途话费

用户提示