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| 1 | 喷雾式涂胶的新应用显示文摘介绍了喷雾式涂胶(SprayCoating)的多种新应用。在形貌起伏很大的表面均匀地涂布光刻胶(抗蚀剂)是一项非常有挑战性的工作,喷雾式涂胶正是为了满足这个挑战而开发的。实践证明,与传统的旋涂技术相比,喷雾式涂胶可以在保持光刻胶均匀性良好的同时显著地节约光刻胶的用量。已经发现此技术可用于非圆形基片和多件基片同时涂布。此外,此技术也可以为脆弱的结构提供保护性涂胶以及悬空结构的填充。 | C. Brubaker M. Wimplinger P. Lindner P. Kettner S. Pargfrieder 高仰月 | 2005 | 电子工业专用设备2005，34，9： | 4 |
| 2 | Differentiation of acute and chronic myeloid leukemic blasts into the dendritic cell lineage: analysis of various differentiation-inducing signals显示文摘 | Mohamed A. Kharfan-Dabaja Ernesto Ayala Inna Lindner Pedro J. Cejas Nizar J. Bahlis Despina Kolonias Louise M. Carlson Kelvin P. Lee | 2005 | Cancer Immunology Immunotherapy2005，，1： | 1 |
| 3 | Film formation with latex particles显示文摘 | Y. Chevalier C. Pichot C. Graillat M. Joanicot K. Wong J. Maquet P. Lindner B. Cabane | 1992 | Colloid & Polymer Science1992，，8： | 1 |
| 4 | Heterologous production and secretion of Clostridium perfringens β-toxoid in closely related Gram-positive hosts显示文摘 | Reindert Nijland Cordula Lindner Mariska van Hartskamp Leendert W. Hamoen Oscar P. Kuipers | 2006 | Journal of Biotechnology2006，，3： | 1 |
| 5 | Closed reduction of distal radius fractures: does instability mean irreducibility?显示文摘 | Florian Wichlas Norbert P. Haas Tobias Lindner Serafim Tsitsilonis | 2013 | Archives of Orthopaedic and Trauma Surgery2013，，8： | 1 |
| 6 | 查看详情显示文摘 | Zipfel J Lindner P Tsianou M Alexandridis P. Richtering W | | 0，，： | 1 |
| 7 | Determination of zeranol, taleranol, zearalenone, α- and β-zearalenol in urine and tissue by high-performance liquid chromatography-tandem mass spectrometry显示文摘 | J. Jodlbauer P. Z?llner W. Lindner | 2000 | Chromatographia (-)2000，，11： | 1 |
| 8 | 用于系统级封装和3D互连的圆片间及芯片-圆片的集成技术显示文摘系统级封装和3D互连的技术可行性及其潜力,近年来在得到了详尽的分析和业界广泛的认可。目前的热点聚集在新颖的制造和集成方案方面,它要求同时满足经济性和技术要求。尽管系统级封装和3维互连的基本原理十分相似,但其广泛的应用范围需要各种各样的制造工艺。 | P. Lindner S. Pargfrieder | 2007 | 电子工业专用设备2007，36，3： | 0 |
| 9 | Nanoimprint Lithography -A Next Generation High Volume Lithography Technique显示文摘Nanoimprint Lithography has been demon-strated to be one of the most promising next genera-tion techniques for large-area structure replicationin the nanometer scale. This fast and low costmethod becomes an increasingly important instru-ment for fabrication of biochemistry,m-fluidic, m-TAS and telecommunication devices, as well as for awide variety of fields in the nm range, like biomedical,nano-fluidics,nano-optical applications, datastorage, etc.Due to the restrictions on wavelength and theenormous development works, linked to high pro-cess and equipment costs on standard lithographysystems, nanoimprint lithography might become areal competitive method in mainstream IC industry.There are no physical limitations encountered withimprinting techniques for much smaller replicatedstructures, down to the sub-10nm range [1]. Amongseveral Nanoimprint lithography techniques resultsof two promising methods, hot embossing lithogra-phy (HEL) and UV-nanoimprinting (UV-NIL) will bepresented. Both techniques allow rapid prototypingas well as high volume production of fully patternedsubstrates for a wide range of materials.This paper will present results on HE and UV-NIL, among them full wafer imprints up to 200mmwith high-resolution patterns down to nm range. | R. Pelzer P. Lindner T. Glinsner B.Vratzov C.Gourgon S.Landis P. Kettner C. Schaefer | 2004 | 半导体技术2004，29，7： | 0 |
| 10 | 用于大批量制造环境的薄晶圆处理——传送和加工技术(英文)显示文摘在半导体生产商不断推进器件和圆片厚度薄型化的形势下,为满足与新产品和加工工艺有关的生产工艺挑战,必须采用更新的分裂方法。新面世的产品射频识别标签,更完善的IC卡以及集成度更高的存储器件,随着更新的从逻辑到存储器及图像传感器各种产品先进封装技术的来临,需要越来越薄基片。对此提出了一种基于临时键合以及新颖的粘接剂技术的适合于薄圆片传送和处理加工的完全解决方案(设备,材料以及工艺过程)。这种方法与25μm以下厚度圆片以及在原有设备没有变更的现有生产线进行薄圆片产品发展路线图加工工艺相适应。 | S. Pargfrieder P. Lindner S. Dwyer T. Matthias | 2007 | 电子工业专用设备2007，36，8： | 0 |
| 11 | 用于化合物半导体制造的先进光刻技术(英文)显示文摘重点讨论了化合物半导体材料加工中的先进光刻技术应用现状。薄形衬底材料在高频及功率器件中的需求,在处理非常易碎和昂贵的衬底时出现了一些新的问题。这种损伤的风险由于要求的多个加工工序而增大,且在接转生产的采用背面加工时会再次出现。叙述了进行自动光刻加工中片子传递和对准过程的一些解决方法。 | J. Weixlberger P. Lindner | 2004 | 电子工业专用设备2004，33，4： | 0 |
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