|
|
|
题名
|
作者
|
年代
|
出处
|
被引量
|
| 1 | 应用超硬大磨粒金刚石砂轮实现BK7光学玻璃的超精密磨削显示文摘首先以91μm磨粒杯形铜基金刚石砂轮作为修整器并结合砂轮在线电解修锐技术(ELID,Electrolytic in- process dressing)对151μm磨粒电镀镍基单层金刚石砂轮进行精密高效的修整。在最佳的修整参数下,同时应用测力仪对两个砂轮间磨削力进行监测,并应用共轴光学位移检测系统对砂轮表面状态进行在位监测,151μm砂轮的回转误差被减小至1~2μm范围,同时砂轮上所有金刚石磨粒被修整出平坦表面并拥有恒定的圆周包迹,此时砂轮达到最佳工作状态。然后应用被良好修整的砂轮对光学玻璃BK7进行磨削加工。磨削试验结果和亚表层完整度评价结果表明新开发的大磨粒金刚石砂轮修整技术的可行性,也验证大磨粒金刚石砂轮只要经过精密修整是可以应用于光学玻璃的延展性超精密磨削加工的,并能实现纳米级的表面粗糙度,显示出大磨粒金刚石砂轮在加工难加工材料和硬脆材料中的良好应用前景。 | 赵清亮 于光 EKKARD Brinksmeier OLTMANN Riemer KAI Rickens | 2006 | 机械工程学报2006，42，10： | 9 |
| 2 | Precision Grinding of Reaction Bonded Silicon Carbide Using Coarse Grain Size Diamond Wheels显示文摘Reaction bonded SiC(RBSiC) is attractive for optical application because of its favorable properties and low fabrication cost. However, the difficultness and cost involved in RBSiC grinding limit its application. The investigation on high efficient and low-cost machining with good grinding quality is desired. Generally, high efficient machining for RBSiC is realized by using coarse grain size grinding wheels, but serious grinding damage is inevitable. In this paper, monolayer nickel electroplated coarse grain size diamond grinding wheels with grain sizes of 46 μm, 91 μm, and 151 μm were applied to the grinding of RBSiC. An electrolytic in-process dressing(ELID) assisted conditioning technique was first developed by using cup shape copper bonded conditioning wheels with grain sizes of 15 μm and 91 μm to generate the conditioned coarse grain size wheels with minimized wheel run-out error within 2 μm, constant wheel peripheral envelop as well as top-flattened diamond grains. Then, the grinding experiments on RBSiC were carried out to investigate the grinding performance and material removal mechanism. The experimental results indicate that the developed conditioning technique is applicable and feasible to condition the coarse grain size diamond wheels under optimal conditioning parameters, and the material removal mechanism involved in RBSiC grinding is the combination of brittle fracture and ductile deformation to generate smooth ground surface. This research is significant for the high efficient and low-cost precision grinding of RBSiC with good ground surface quality. | ZHAO Qingliang CHEN Junyun BRINKSMEIER E | 2010 | Chinese Journal of Mechanical Engineering2010，23，3： | 3 |
| 3 | Influence of Milling Process Parameters on the Surface Integrity of CFRP显示文摘 | Oliver Pecat Rüdiger Rentsch Ekkard Brinksmeier | 2012 | Procedia CIRP2012，，： | 2 |
| 4 | Low Damage Drilling of CFRP/Titanium Compound Materials for Fastening显示文摘 | Oliver Pecat Ekkard Brinksmeier | 2014 | Procedia CIRP2014，，： | 2 |
| 5 | Advances in Modeling and Simulation of Grinding Processes显示文摘 | E. Brinksmeier J.C. Aurich E. Govekar C. Heinzel H.-W. Hoffmeister F. Klocke J. Peters R. Rentsch D.J. Stephenson E. Uhlmann K. Weinert M. Wittmann | 2006 | CIRP Annals - Manufacturing Technology2006，，2： | 2 |
| 6 | Utilization of grinding heat as a new heat treatment process显示文摘 | Brinksmeier E Brockhoff T | 1996 | Annals of the CIRP1996，45，1： | 1 |
| 7 | Orbital drilling kinematics显示文摘 | BRINKSMEIER E FANGMANN S MEYER I | 2008 | Production Engineering2008，2，3： | 1 |
| 8 | Capability profile of hard cutting and grindingprocesses显示文摘 | KLOCKE F BRINKSMEIER E WEINERT K | 2005 | Annals of the CIRP2005，54，2： | 1 |
| 9 | Surface Integrity in material removal processes:Recent advances 显示文摘 | Jawahir I S Brinksmeier E M'Saoubi R | 2011 | CIRP Annals-Manufacturing Technology2011，60，2： | 1 |
| 10 | Finishing of structured surfaces by abrasive polishing显示文摘 | BRINKSMEIER E RIEMER O GESSENHARTER A | | 0，，： | 1 |
| 11 | Utilization of Grinding Heat as a New Heat Treatment Proeess显示文摘 | Brinksmeier E Broekhoff T | 1996 | Annals of the CIRP1996，45，1： | 1 |
| 12 | Finishing of structuredsurfaces by abrasive polishing显示文摘 | BRINKSMEIER E RIEMER O | 2006 | Precision Engineering--Journal of the International Societies for Precision Engineering and Nanoteclmology2006，30，3： | 1 |
| 13 | Grinding at very Low Speeds显示文摘 | Brinksmeier E Schneider C | 1997 | Annals of the CIRP1997，46，1： | 1 |
| 14 | Drilling of Multi-Layer Composite Materials consisting of Carbon Fiber Reinforced Plastics (CFRP), Titanium and Aluminum Alloys显示文摘 | E. Brinksmeier R. Janssen | 2002 | CIRP Annals - Manufacturing Technology2002，，1： | 1 |
| 15 | Chip formation mechanismsin grinding at low speeds显示文摘 | Brinksmeier E Giwerzew A | 2003 | Annals of the CIRP2003，52，1： | 1 |
| 16 | High Speed Grinding:Fundamental and State of Art in Europe,Japan and USA显示文摘 | Klocke F Brinksmeier E Evans C | | 0，，02： | 1 |
| 17 | Ultra-precision grinding显示文摘 | BRINKSMEIER E MUTLUGUNES Y KLOCKE F | 2010 | CIRP Annals Manufacturing Technology2010，，59： | 1 |
| 18 | High - Speed Grinding - Fundaments and State of the Art in Europe, Japan and the USA显示文摘 | Klocke F Brinksmeier E Evans C | 1997 | Annals of the CIRP1997，46，2： | 1 |
| 19 | Friction,cooling and lubrication in grinding显示文摘 | BRINKSMEIER E HEINZEL C WITTMANN M | 1999 | CIRP Annals1999，48，： | 1 |
| 20 | Capability profile of hard cutting and grinding processes 显示文摘 | Klocke F Brinksmeier E Weinert K | 2005 | Annals of the CIRP2005，54，2： | 1 |
您所在的机构暂未开通此部分的功能，请联系管理员