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13篇 您的检索式:作者名="Subbarayan G"
    题名 作者 年代 出处 被引量
1Microstructural coarsening in Sn-Ag-based solders and its effects on mechanical properties显示文摘DUTTA I KUMAR P SUBBARAYAN G 2009Journal of the Minerals Metals and Materials Society2009,61,6:1
2Response Surface Models for Efficient, Modular Estimation of Solder Joint Reliability in Area Array Packages显示文摘Zhang L Subbarayan G Hunter B C Rose D 2005Microelectronics Reliability2005,,:1
3A meshless, compositional approach to shape optimal design 显示文摘Zhang X Rayasam M Subbarayan G 2007Computer Methods in Applied Mechanics and Engineering2007,196,1720:1
4The effect of polydispersivity on the thermal conductivity of particulate thermal interface materials 显示文摘Kanuparthi S Subbarayan G Siegmund T 2009Components and Packaging Technologies IEEE Transactions on2009,32,:1
5Pareto-optimal formulations for cost versus colorimetric accuracy tradeoffs in printer color management 显示文摘Littlewood D J Drakopoulos P A Subbarayan G 2002ACM Transactions on Graphics2002,21,2:1
6查看详情显示文摘Radhakrishnan S Subbarayan G Nguyen L Mazotti W 0,,:1
7Controlling the gray component with pareto-optimal color space transformations显示文摘LITTLEWOOD D SUBBARAYAN G 2002Journal of Imaging Science and Technology2002,46,6:1
8Differential expression of Glut 1 mRNA and protein levels correlates with increased sensitivity to the glyco-conjugated nitric oxide donor (2-glu-SNAP) in different tumor cell types 显示文摘Subbarayan P R Wang P G Lampidis T J 2008J Chemother2008,20,1:1
9Power cycling thermal fatigue Of SnPb solder joints on a chip scale package 显示文摘Towashiraporn P Gall K Subbarayan G 2004International Journal of Fatigue2004,,26:1
10Pareto-optimalformulations for cost versus colorimetric accuracy tradeoffs in printer color management显示文摘LITTLEWOOD D J DRAKOPOULOS P A SUBBARAYAN G 2002ACM Transactions on Graphics2002,21,2:1
11Clinical features that identify children with primary immunodeficiency diseases显示文摘SUBBARAYAN A COLARUSSO G HUGHES S M 2011Pediatrics2011,127,5:1
12A hybrid model for computationally efficient fatigue fracture simulations at microelectronic assembly interfaces 显示文摘TOWASHIRAPORN P SUBBARAYAN G DESAIB C S 2005In- ternational Journal of Solids and Structures2005,42,15:1
13The effect of polydispersivity on the thermal conductivity of particulate thermal interface materials 显示文摘KANUPARTHI S SUBBARAYAN G SIEGMUND T et 'al 2009Components and Packaging Technol IEEE Transactions on2009,32,2:1
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