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16篇 您的检索式：作者名="Pecht E"

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		题名	作者	年代	出处	被引量
	1	Effective Lifetimeaware Routing in Wireless Sensor Networks显示文摘	Karkvandi H R Pecht E Yadid-Pecht O	2011	IEEE Sensors Journal2011，11，12：	1
	2	FOG-based navigation in downhole environment during horizontal drilling utilizing a complete inertial measurement unit:Directional measurement-while-drilling surveying显示文摘	Ledroz A G Pecht E Cramer D	2005	IEEE Transactions on Instrumentation and Measurement2005，54，10：	1
	3	Parameter selection for healthmonitoring of electronic products 显示文摘	Kumar S Dolev E Pecht M	2010	MicroelectronicsReliability2010，50，2：	1
	4	FOG-based navigation in downhole environment during horizontal drilling utilizing a com- plete inertial measurement unit: directional measurement-while- drilling surveying 显示文摘	Ledroz A G Pecht E Cramer D	2005	IEEE Transations on Instrumentation and M easurement2005，54，5：	1
	5	Characterization of functional relationship between temperature and microelectronic reliability 显示文摘	Lall P Pecht M Hakim E B	1995	Microelectronics Reliability1995，，35：	1
	6	显示文摘	Ortega E Schweitzer Stenner R Pecht I	1988	EMBO J1988，7，13：	1
	7	Parameter selection for health monitoring of electronic products 显示文摘	KUMAR S DOLEV E PECHT M	2009	Microe- lectronics Reliability2009，49，9：	1
	8	Observability analysis for INS alignment in horizontal drilling 显示文摘	PECHT E MINTCHEV M P	2007	IEEE Trans Instrum Meas2007，56，5：	1
	9	Characterization of hygroscopic swelling behavior of mold compounds and plastic packages显示文摘	STEILRECHT E HAN B PECHT M G	2004	IEEE Components and Packaging Technologies2004，27，3：	1
	10	Observability analysis for INS alignment in horizontal drilling显示文摘	PECHT E MINTCHEV M P	2007	IEEE Transactions on Instrumentation and Measurement2007，56，5：	1
	11	Hygroscopic swelling and sorption characteristics of epoxy molding compounds used in electronic packaging显示文摘	ARDEBILI H WONG E H PECHT M	2003	IEEE Transactions on Components and Packaging Technologies2003，26，1：	1
	12	Modeling of Observability during in-drilling alignment for horizontal directional drilling显示文摘	PECHT E MINTCHEV M P	2007	IEEE Transactions on Instrumentation and Measurement2007，56，5：	1
	13	Parameter selection for health monitoring of electronic products 显示文摘	Kumar S Dolev E Pecht M Q	2010	Microelectron- ics Reliability2010，50，2：	1
	14	Effective Lifetime-A-ware Routing in Wireless Sensor Networks显示文摘	Karkvandi H R Pecht E Yadid Pecht O	2011	IEEE Sensors Journal2011，11，12：	1
	15	FOG-basednavigation in downhole environment during horizontaldrilling utilizing a complete inertial measurement unit:Directional measurement-while-drilling surveying显示文摘	Ledroz A G Pecht E Cramer D	2005	IEEETransactions on Instrumentation and Measurement2005，54，5：	1
	16	Hygroscopic swelling and sorption characteristics of epoxy molding compounds used in electronic packaging 显示文摘	Ardebili H Wong E H Pecht M	2003	IEEE Trans Compon Packg Technol2003，26，1：	1

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