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62篇 您的检索式:作者名="PECHT M G"
    题名 作者 年代 出处 被引量
1Embedded Capaci- tors in Printed Wiring Board:A Technological Review显示文摘Alam M A Azarian M H Pecht M G 2012Journal of Electronic Materials2012,41,8:1
2Flex crackizag of multilayer ceramic capacitors assembled with Pb-free and tin-lead solders 显示文摘KEIMASI M AZARIAN M H PECHT M G 2008IEEE Trans Device Mater Reliab2008,,8:1
3Economics of rare earth elements in ceramic capacitors显示文摘ALAM M A ZUGA L PECHT M G 2012Ceram Inter2012,38,8:1
4Electrostatic moni- toring of gas path debris for aero-engine 显示文摘WEN ZH H ZUO H F PECHT M G 2011IEEE Trans- action on reliability2011,60,1:1
5Prognostics and health management of electronics 显示文摘VICHARE N M PECHT M G 2006IEEE Transactions on Components and Packaging Technologies2006,29,1:1
6Embedded capacitors in printed wiring board: A technological review显示文摘ALAM M A AZARIAN M H PECHT M G 2012Journal of Electric Materials2012,41,8:1
7Electrostatic monito- ring of gas path debris for aero-engines 显示文摘WEN ZH H ZUO H PECHT M G 2011Reliability2011,60,1:1
8Electronic part life cycle concepts and obsolescence forecasting显示文摘Solomon R Sandborn P A Pecht M G 2000Components and Packaging Technologies2000,23,4:1
9Prognostics and health management of electronics显示文摘VICHARE N M PECHT M G 2006IEEE Transactions on Components and Packaging Technologies2006,29,1:1
10Electronic Part Life Cycle Concepts and Obsolescence Forecasting显示文摘SOLOMON R SANDBORN P A PECHT M G 2000IEEE Transactions on Components and Packaging Techno- logies2000,23,4:1
11Embedded Capaci- tors in Printed Wiring Board: A Technological Review显示文摘Alam M A Azarian M H Pecht M G 2012Journal of Electronic Materials2012,41,8:1
12Prognostics and health management of electronics显示文摘Vichare N M Pecht M G 2006IEEE Transactions on Components and Packaging Technologies2006,29,1:1
13Electronic part life cycle concepts and obsolescence forecasting显示文摘SOLOMON R SANDBORN P A PECHT M G 2000IEEE Trans on Components and Packaging Technologies2000,23,4:1
14Anomaly detection through a bayesian support vector machine显示文摘SOTIPIS V A TSE P W PECHT M G 0,,02:1
15Prognostics and health management of electronics显示文摘Vichare N M Pecht M G 2006IEEE Transactions on Components and Packaging Technologies2006,29,3:1
16Effect of temperature and relative humidity on the impedance degradation of dust-contaminated electronics显示文摘Song B Azarian M H Pecht M G 2013Journal of the Electrochemical Society2013,160,3:1
17Development of an optimizedcondition-based maintenance system by data fusion and relia-bility-centered maintenance 显示文摘NIU G YANG B S PECHT M 2010Reliability Engineering andSystem Safety2010,95,78:1
18A synthetic thymic hormone,THF-γ2,repairs immunodeficiency of mice cured of plasmacytoma by melphalan显示文摘OPHIR R PECHT M RASHID G 1990Int J Cancer1990,45,:1
19Prognostics and health management of electronics显示文摘VICHARE N M PECHT M G 2006IEEE Transactions on Components and Packaging Technologies2006,29,1:1
20Prognostics and Health Management of Electronics显示文摘Vichare NM Pecht M G 2006IEEE2006,29,1:1
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