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17篇 您的检索式：期刊名="MicroelectronicsReliability"

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		题名	作者	年代	出处	被引量
	1	ThermalpropertiesofdiaGmond/coppercomposite material显示文摘	YoshidaK MorigamiH	2004	MicroelectronicsReliability2004，44，：	1
	2	Warpage mechanism analysesof strip panel type PBGA chip packaging显示文摘	KIM Y K PARK I S CHOI J	2010	MicroelectronicsReliability2010，50，3：	1
	3	Time-series models for reliability evaluation of power systems including wind energy 显示文摘	Billinton R Chen H Ghajar R	1996	MicroelectronicsReliability1996，36，9：	1
	4	Parameter selection for healthmonitoring of electronic products 显示文摘	Kumar S Dolev E Pecht M	2010	MicroelectronicsReliability2010，50，2：	1
	5	Thermal cycling reliability of SnAgCu and SnPb solder joints: A comparison for several IC-packages显示文摘	VANDEVELDE B GONZALEZ M LIMAYE P	2007	MicroelectronicsReliability2007，47，23：	1
	6	Solder-joint reliability of HVQFN-packages subjected to thermal cycling显示文摘	DE V J JANSEN M VAN D W	2009	MicroelectronicsReliability2009，49，：	1
	7	Mechanical Reliability of MEMS - structures under shock load显示文摘	Wagner U Franz J Schweiker M	2001	MicroelectronicsReliability2001，41，：	1
	8	Development of SnAg-hasedlead-free solders in electronics packaging显示文摘	Zhang L He C W Guo Y H	2012	MicroelectronicsReliability2012，52，3：	1
	9	Experimentalinvestigation on the performance of CPU coolers: effect of heat pipeinclination angle and the use of nanofluids 显示文摘	Yousefi T Mousavi S A Farahbakhsh B Saghir M Z	2013	MicroelectronicsReliability2013，53，12：	1
	10	A fast mechanical test technique for life time estimation of micro-joints 显示文摘	Khatibi G Wroczewski W Weiss B	2008	MicroelectronicsReliability2008，，48：	1
	11	The characterization of electrically conductive silver ink patterns on flexible substrates显示文摘	Merilampi S Laine-Ma T Ruuskanen P	2009	Microelectronicsreliability2009，49，7：	1
	12	Selected failure mechanisms of modem power modules显示文摘	Ciappa M	2002	MicroelectronicsReliability2002，42，4：	1
	13	SPC Chart selection process显示文摘	ANJARD R P	1995	MicroelectronicsReliability1995，35，11：	1
	14	Reverse-bias stress of high electron mobilitytransistors : correlation between leakage current,currentcollapse and trap characteristics 显示文摘	ROSSETTO I MENEGHINI M MENEGHESSO G etal	2013	MicroelectronicsReliability2013，53，91011：	1
	15	Lifetime predictions of LED-based light bars by accelerated degradation test显示文摘	Wang F K Chu T P	2012	MicroelectronicsReliability2012，52，7：	1
	16	La-sermodulationmappingonanunmodifiedlaserscanningmicroscope显示文摘	ZachariasseFrank BoonGerben FaggionGal etal	2010	MicroelectronicsReliability2010，50，9：	1
	17	A single-server M/G/1 queuing system subject to breakdowns-some reliability and queuing problem显示文摘	Tang Y H	1997	MicroelectronicsReliability1997，37，2：	1

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