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204篇 您的检索式：作者名="M Pecht"

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	题名	作者	年代	出处	被引量
1	Embedded Capaci- tors in Printed Wiring Board:A Technological Review显示文摘	Alam M A Azarian M H Pecht M G	2012	Journal of Electronic Materials2012，41，8：	1
2	Prognostics implementa- tion of electronics under vibration loading显示文摘	GU J BARKER D PECHT M	2007	Microelec- tronics Reliability2007，47，12：	1
3	Evaluation of the microstructure and whisker growth in Sn-Zn-Ga solder with Pr content 显示文摘	Ye H Xue S B Pecht M	2012	Journal of Materials Research2012，27，14：	1
4	Flex crackizag of multilayer ceramic capacitors assembled with Pb-free and tin-lead solders 显示文摘	KEIMASI M AZARIAN M H PECHT M G	2008	IEEE Trans Device Mater Reliab2008，，8：	1
5	Economics of rare earth elements in ceramic capacitors显示文摘	ALAM M A ZUGA L PECHT M G	2012	Ceram Inter2012，38，8：	1
6	Prognostics and health management of electronics显示文摘	VICHARE N PECHT M	2006	IEEE Transactions on Components Packaging and Manufacturing Technology2006，，1：	1
7	A life consumption monitoring methodology for electronic systems 显示文摘	Ramakrishnan A Pecht M	2003	IEEE Transactions on Components and Packaging Technologies2003，26，3：	1
8	The effect of annealing on tin whisker growth显示文摘	FUKUDA Y OSTERMAN M PECHT M	2006	IEEE Transactions on Electronics Packaging Manufacturing2006，29，4：	1
9	Electrostatic moni- toring of gas path debris for aero-engine 显示文摘	WEN ZH H ZUO H F PECHT M G	2011	IEEE Trans- action on reliability2011，60，1：	1
10	Length distribution analysis for tin whisker growth显示文摘	FUKUDA Y OSTERMAN M PECHT M	2007	IEEE Transactions on Electronics Packaging Manufacturing2007，30，1：	1
11	Prognostics and health management of electronics 显示文摘	VICHARE N M PECHT M G	2006	IEEE Transactions on Components and Packaging Technologies2006，29，1：	1
12	Light emmiting diodes reliability review显示文摘	Chang MH Das D Varde PV Pecht M	2012	Microelectron Reliab2012，52，5：	1
13	Prognostics and Health Management of Electronics显示文摘	Vichare N Pecht M	2006	IEEE Trans on Components and Packaging Technologies2006，29，1：	1
14	A multi-compo- nent and multi-failure mode inspection model based on the de- lay time concept显示文摘	WANG W B BANJEVIC D PECHT M	2010	Reliability Engineering System Safe- ty2010，95，8：	1
15	Embedded capacitors in printed wiring board: A technological review显示文摘	ALAM M A AZARIAN M H PECHT M G	2012	Journal of Electric Materials2012，41，8：	1
16	The impact of electrical current, mechanical bending, and thermal annealing on tin whisker growth显示文摘	FUKUDA Y OSTERMAN M PECHT M	2007	Microelectronics Reliability2007，47，1：	1
17	Why the traditional reliability prediction models do not work-is there an alternative? 显示文摘	Pecht M	1996	Electronic Cooling1996，2，1：	1
18	Bogus:electronic manufacturing and con- sumers confront a rising tide of counterfeit electronics 显示文摘	PECHT M TIKU S	2006	IEEE Spectrum2006，43，5：	1
19	Electrostatic monito- ring of gas path debris for aero-engines 显示文摘	WEN ZH H ZUO H PECHT M G	2011	Reliability2011，60，1：	1
20	A Life Consumption Monitoring Methodology for Electronic Systems显示文摘	Ramakrishnan A Pecht M	2003	IEEE Trans on Components and Packaging Technologies2003，26，3：	1

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