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21篇 您的检索式：作者名="Devre M"

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	题名	作者	年代	出处	被引量
1	Optimization of gas flow and etch depth uniformity for plasma etching of large area GaAs wafers显示文摘	LEE J W JUNG P G DEVRE M	2002	SSE2002，46，：	1
2	Advanced selective dry etching of GaAs/AlGaAs in high density inductively coupled plasmas显示文摘	J W Lee M W Devre B H Reelfs	2000	J Vac Sci Technol2000，18，4：	1
3	Optimization of Gas Flow and Etch Depth Uniformity for Plasma Etching of Large Area GaAs Wafers 显示文摘	Lee J W Jung P G Devre M	2002	Solid-State Electronics2002，46，5：	1
4	Optimization of gas flow and etch depth uniformity for plasma etching of large area GaAs wafers显示文摘	J W Lee P G Jung M Devre	2002	Solid-State Electronics2002，，46：	1
5	Characterization of ex situ presulfided Ni/Al2O3 catalysts for pyrolysis gasoline hydrogenation显示文摘	Hoffer B M Devred F Kooyman P J	2002	Journal of Catalysis2002，209，：	1
6	The thin layer drying characteristics of hazelnuts during roasting显示文摘	Ozdemir M Devres Y O	1999	Journal of Food Engineering1999，42，4：	1
7	Advanced Selective Dry Etching of GaAs/AlGaAs in High Density Inductively Coupled Plasmas显示文摘	Lee J W Devre M W Reeffs B H	2000	Vac Sci Technol2000，18，4：	1
8	The thin layer drying charac- teristics of hazelnuts during roasting显示文摘	Ozdemir M Devres Y O	1999	Journal of Food Engineering1999，42，4：	1
9	The thin layer drying characteristics of hazelnuts during roasting显示文摘	0zdemir M Devres Y O	1999	Journal of Food Engineering1999，42，4：	1
10	Analysis of color development during roasting of hazelnuts using response surfacemethodology显示文摘	Ozdemir M Devres O	2000	Journal of Food Engineering2000，45，1：	1
11	The thin layer dryingcharacteristics of hazelnuts during roasting显示文摘	Ozdemir M Devres Y O	1999	Journal ofFood Engineering1999，42，4：	1
12	The thin layer drying characteristics of hazelnuts during roasting显示文摘	Ozdemir M Devres Y	1999	Journal of Food Engineering1999，42，：	1
13	Optimization of gas flow and etch depth uniformity for plasma etching of large area GaAs wafers显示文摘	Jung P G Devre M	2002	Solid-State Electronics2002，46，：	1
14	Stress ControUed Si-based PECVD Dielectrics 显示文摘	Mackenzie K D Johnson D J DeVre M W	2005	Electrochemical Society Proceedings2005，2005，1：	1
15	Analysis of color develop-ment during roasting of hazelnuts using responsesurface methodology 显示文摘	Ozdemir M Devres O	2000	Journal of Food Engi-neering2000，45，1：	1
16	Kinetics of color changes of hazelnuts during roasting显示文摘	Ozdemir M Devres O	2000	Journal of Food Engineering2000，44，7：	1
17	Optimization of gas flow and etch depth uniformity for plasma etching of large area GaAs wafers显示文摘	LEE J W JUNG P G DEVRE M	2002	Solid-State Electronics2002，46，5：	1
18	Kinetics of color changes of hazelnuts during roasting显示文摘	Ozdemir M Devres O	2000	Journal of Food Engineering2000，44，7：	1
19	The thin-layer drying characteristics of hazelnuts during roasting 显示文摘	OZDEMIR M DEVRES Y O	1999	Journal of Food Engineering1999，42，4：	1
20	Advanced selective dry etching of GaAs/A1GaAs in high density in- ductively coupled plasmas显示文摘	LEE J W DEVRE M W REELFS B H	2000	Journal of Vacuum Science and Technology A2000，18，4：	1

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