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725篇 您的检索式:期刊名="Microsystems Technology"
    题名 作者 年代 出处 被引量
1Local heat transfer characteristic in a single rotating disk and co-rotating disks显示文摘Cho H H Won C H Ryu G Y 2003Microsystem Technologies2003,,9:1
2Microcasting of parts made of metal alloys显示文摘BAUMEISTER G RUPRECHT R HAUSSELT J 2004Microsystem Technology2004,10,:1
3Simulation of the filling process in molding components with micro channels显示文摘YONG W B 2005Microsystem Technologies2005,11,6:1
4Electromechanical characterization of a new micro programmable blazed grating by laser Doppler vibrometry ( LDV ) 显示文摘Yu Y Yuan W Qiao D 2009Microsystem Technology2009,15,4:1
5Calculating capacitance and analyzing nonlinearity of micro-aecelerometers by Schwarz--Christoffel mapping显示文摘He Jiangbo Xie Jin He Xiaoping 2014Microsystem Technologies2014,20,6:1
6Replication of LIGA structures using microcasting显示文摘BAUMEISTER G RUPRECHT R HAUSSELT J 2004Microsystem Technology2004,10,:1
7Superplastic extrusion of microgear shaft of 10μm in module显示文摘Saotome Y Iwazaki H 2000Microsystem Technologies2000,6,:1
8A Paper-transport Mecha- nism Using Tapered Rubber Rollers to Generate Cross-di- rectional Tractive Force 显示文摘TAMAMOTO J YOSHIDA K 2003Microsystem Technologies2003,9,8:1
9Fabrication of antiscatter grids and collimators for X-ray and gamma-ray imaging by lithography and electroforming显示文摘Makarova O V Yang G H Amstutz P T 2008Microsystem Technologies2008,14,911:1
10Microfabrication of ceramic microreactors显示文摘Knitter R Gohring D 2001Microsystem Technologies2001,,7:1
11Modeling and simula-tion of levitation control for a micromachined electrostaticallysuspended gyroscope 显示文摘XIAO Q J CHEN W Y LI S Y 2010Microsystem Technologies2010,16,3:1
12Fabrication process of a micro-inductor utilising a magnetic thin film core 显示文摘FLYNN D SUDAN N S TOON A 2006Microsystem Technologies2006,12,:1
13Adhesive wafer bonding with photosensitive polymers for MEMS fabrication显示文摘Cakmak E Dragoi V Capsuto E 2010Microsystem Technologies2010,16,5:1
14Development of fluid-based heating and pressing systems for micro hot embossing显示文摘J.-H. Chang S.-Y. Yang 2005Microsystem Technologies2005,,6:1
15Modal analysis of a unimorph piezoelectrical transducer显示文摘Liu C Cui T Zhou Z 2003Microsystem Technologies2003,9,6:1
16Replication techniques for a metal microcomponent having real 3D shape显示文摘CHUNG S PARK S LEE L JEONG H 2005Microsystem Technology2005,11,:1
17T-CAD for the analysis and verification of processing sequences 显示文摘Hansen U Büttgenbach S 2004Microsystem Technologies2004,10,3:1
18Injection molding of microstructured components from plastics,metals and ceramics显示文摘Ruprecht R Getzelt T Muller K 2002Microsystem Technology2002,,8:1
19Influence of sudhce stress on fk'eqquency of mi- crocmantilever based biosensors 显示文摘Ren Q Zhao Y P 2004Microsystem Technologies2004,10,4:1
20The mechanical properties,dimensional tolerance and microstructural characterization of micro-molded ceramic and metal components显示文摘GARINO T J MORALES A M BOYCE B L 2004Microsystem Technologies2004,,10:1
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