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26篇 您的检索式：期刊名="Microeleetronic Engineering"

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	题名	作者	年代	出处	被引量
1	MEMS variable optical attenuator with a compound latch 显示文摘	SYMS T T A ZOU H STAGG J	2004	Microeleetronic Engineering2004，12，3：	1
2	Fluorinated materials for UV nanoimprint lithography 显示文摘	YASUHIDE K FUMIKO N YASUHIRO S	2007	Microeleetronic Engineering2007，84，58：	1
3	Formation of stacking faults in nitrogen-doped silicon single crystals 显示文摘	Ammon W V Twetzel Zemke D	2003	Microeleetronic Engineering2003，66，：	1
4	Controlled assembly of single SWNTs bundle using dielectrophoresis显示文摘	SEO H W HAN C S CHOI D G KIM K S LEE Y H	2005	Microeleetronic Engineering2005，81，：	1
5	In- vestigation of oxidation-induced strain in a top-down Si nanowire platform 显示文摘	NAJMZADEH M BOUVET D DOBROSZ P	2009	Microeleetronic Engineering2009，86，789：	1
6	Chemical mechanical polishing performances by filtering and retreatment of used silica abrasives slurry显示文摘	Park Sung-Woo Kim Nam-Hoon etc	2005	Microeleetronic Engineering2005，77，：	1
7	Investigation of photoresist -specific linearity in optical lithography显示文摘	Brian Martin Graham Arthur	1997	Microeleetronic Engineering1997，，35：	1
8	Wide-baud- width piezoelectric energy harvester integrated with parylene-C beam structures 显示文摘	Huang Po-Cheng Tsai Tung-Hsiang Yang Yao-Joe	2013	Microeleetronic Engineering2013，111，：	1
9	Investigation of photoresist-specific linearity in optical lithography显示文摘	Brian M Graham A	1997	Microeleetronic Engineering1997，35，14：	1
10	Fabrication of anti-reflec- tive structures using hot embossing witha stainless steel template ir- radiated by femtosecond laser 显示文摘	Yao T F Wu einghan Wu T M	2011	Microeleetronic Engineering2011，88，29：	1
11	A soft - imprint technique for submicron - scale patterns using a PDMS mold 显示文摘	Choi W M Park O O	2004	Microeleetronic Engineering2004，37，：	1
12	Synthesis, charac- terization of CcO2@aSiO2 nanoparticles and their oxide CMP be- havior 显示文摘	ZHAO X B LONG R W CHEN Y	2010	Microeleetronic Engineering2010，87，9：	1
13	Polishing behaviors of single crystalline ceria abrasives on silicon dioxide and silicon nitride CMP 显示文摘	Oh M H Singh R K Gupta S	2010	Microeleetronic Engineering2010，87，12：	1
14	Fast thermal nanoimprint lithography by a stamp with inte- grated heater 显示文摘	TORMEN M MALUREANU R PEDERSEN R H	2008	Microeleetronic Engineering2008，85，56：	1
15	High temperature stability of Zr-Si-N diffusion barrier in Cu/Si contact system显示文摘	Wang Y Zhu C C Song Z X	2004	Microeleetronic Engineering2004，71，1：	1
16	Cu/barrier CMP on porous low-k based interconnect schemes 显示文摘	GOTrFRIED K SCHUBERT I SCHULZ S E	2006	Microeleetronic Engineering2006，83，1112：	1
17	Fabrication of metallic nanocavities by soft UV nanoimprint lithography 显示文摘	SHIJ CHEN J DECANINI D	2009	Microeleetronic Engineering2009，86，456：	1
18	Modelling and simulation for dielectric constant of aerogel 显示文摘	Xia Xiao Reinhard Streiter Gang Ruan	2000	Microeleetronic Engineering2000，，54：	1
19	Improving Stamps for 10 nm Level Wafer Scale Nanoimprint Lithography显示文摘	BECK M GRACZYK M MAXIMOV I	2002	Microeleetronic Engineering2002，6162，：	1
20	70 nm features on 140 nm period using evanescent near field optical lithography 显示文摘	ALKAISI M M BLAIKIE R J MCNAB S J	2000	Microeleetronic Engineering2000，53，14：	1

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