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27篇 您的检索式：期刊名="MicroelectronicEngineering"

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	题名	作者	年代	出处	被引量
1	Fluoropolymerbasedresist materials for 157 nm lithography 显示文摘	MTRIUMI NSHIDA TYAMAZAKIal	2002	MicroelectronicEngineering2002，61，：	1
2	Biomimetics of underwater hair cell sensing显示文摘	RIZZI F QUALTIERI A DATTOMA T	2014	MicroelectronicEngineering2014，132，：	1
3	Modeling, fabrication and characterization of microcoilsas magnetic inductors for wireless power transfer显示文摘	AMATO Massimiliano DALENAFrancesco COVIELLOCristina	2013	MicroelectronicEngineering2013，111，：	1
4	An overview of supercritical CO2 applications in microelectronics processing 显示文摘	GINA L W CHRISTOPHER K O	2003	MicroelectronicEngineering2003，65，12：	1
5	Morphology and mechanical properties of intermetalliccompounds in SnAgCu solder joints显示文摘	RAO B S S C WENG J SHEN L LEE T K ZENG K Y	2010	MicroelectronicEngineering2010，87，11：	1
6	Effi-cient infrared emission from periodically patterned thinmetal films on a Si photonic crystal显示文摘	Theodoni P Bayiati P Chatzichristidi M	2008	MicroelectronicEngineering2008，85，56：	1
7	Design anddynamics of a 3-DOF flexure-based parallel mechanismfor micro/nano manipulation显示文摘	TIAN Y SHIRINZADEH B ZHANG D	2010	MicroelectronicEngineering2010，87，2：	1
8	Modified space-charge limited conduction in tantalum pentoxide MIM capacitors显示文摘	Martinez V Besset C Monsieur F	2007	MicroelectronicEngineering2007，84，910：	1
9	Effect ofmechanical process parameters on chemical mechanical polishing ofAl thin films 显示文摘	WoongChoa YoominAhnb CHANG-WOOKBAEKC	2003	MicroelectronicEngineering2003，65，：	1
10	Preparation,characterizationandoxideCMPperformanceofcompositepolystyreneGcoreceriaGshellabrasives 显示文摘	ChenY LuJ ChenZ	2011	MicroelectronicEngineering2011，88，：	1
11	L Jay Guo,A combined-nanoimprint-andphotohthography patterning technique显示文摘		2004	MicroelectronicEngineering2004，71，：	1
12	PolishingbehaviorsofsinglecrystallineceriaabrasivesonsilicondioxideandsiliconnitrideCMP 显示文摘	OhM SinghR K GuptaS etal	2010	MicroelectronicEngineering2010，87，：	1
13	A Common Framework for Soft and Hard Breakdown in Ultrathin Oxides Based on the Theory of Point Contact Conduction 显示文摘	Miranda E Sunné J Rodríguez R	1999	MicroelectronicEngineering1999，48，2：	1
14	Optimization of a reverse-offset printing process and its application to a metal mesh touch screensensor显示文摘	Choi Young-Man Lee Eon-Seok Tail-Min	2015	MicroelectronicEngineering2015，134，：	1
15	Adhesion problems in deep-etch X-raylithography caused by fluorescence radiation from the plating base显示文摘	Pantengurg F J Chlebek J El-Kholi A	1994	MicroelectronicEngineering1994，23，：	1
16	High speed TSV filling with molten solder显示文摘	Ko Y K Fujii H T Sato Y S		MicroelectronicEngineering0，89，：	1
17	Fahrbcation of metallic SPM tips by combining UV nanoimprint lithography and focused ion beam processing显示文摘	JAMBRECK J D SCHMITT H AMON B	2010	MicroelectronicEngineering2010，87，5678：	1
18	Acetic acid and phosphoricacid adding to improve tantalum chemical mechanical polis-hing in hydrogen peroxide-based slurry 显示文摘	Chen Y H Tsai T H Yen S C	2010	MicroelectronicEngineering2010，87，2：	1
19	Room-temperature andlow-pressure nanoimprint lithography显示文摘	LEBIB A CHEN Y CAMBRIL E	2002	MicroelectronicEngineering2002，61，7：	1
20	Development of a novel,low-viscosity UV-curable polymersystem for UV-nanoimprint lithography显示文摘	VOGLER M WIEDENBERG S MHLBERGER M	2007	MicroelectronicEngineering2007，84，5678：	1

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