维普期刊资源整合服务平台（V6.5）

187篇 您的检索式：期刊名="Electronics Packaging Manufacturing IEEE Transactions"

选中清除导出查看参考文献查看引证文献引用追踪共10页首页上一页第1页下一页末页 /10 跳转

	题名	作者	年代	出处	被引量
1	Printed circuit board recycling: A state-of-the-art survey显示文摘	JIANGZHI L SHRIVASTAVA P ZONG G	2004	Electronics Packaging Manufacturing IEEE Transactions2004，27，1：	1
2	ESD Phenomena in GMR Heads in the Manufacturing Process of HDD and GMR Heads显示文摘	Matsugi Junya Mizoh Yoshiaki Nakano Taro	2005	IEEE Transaction on Electronics Packaging Manufacturing2005，28，3：	1
3	Rough Set Theory:a Data Mining Tool for Semiconductor Manufacturing显示文摘	Andrew Kusiak	2001	IEEE Transactions on Electronics Packaging Manufacturing2001，24，1：	1
4	A new bumping process using the lead- free solder paste 显示文摘	SUGA T SAITO K	2002	IEEE Transactions on Electronics Packaging Manufacturing2002，25，4：	1
5	Comprehensive treatment of moisture induced failure in IC packaging 显示文摘	WONG E H KOH S W LEE K H	2002	IEEE Transactions on Electronics Packaging Manufacturing2002，25，3：	1
6	The changing automotive environment: high-temperature electronics 显示文摘	Johnson R W Evans J L Jacobsen Peter	2004	IEEE transactions on electronics packaging manufacturing2004，27，3：	1
7	Grant viable plastics recycling from end-of-life electronics显示文摘	Qu Xiuli Ann Julie Williams S	2006	IEEE Transactions on Electronics Packaging Manufacturing2006，29，1：	1
8	Solder joints inspe(~tion using a neural network and fuzzy rule-based classification method显示文摘	Ko K W Cho H S	2000	IEEE Transactions on Electronics Packaging Manufacturing2000，23，2：	1
9	The effect of annealing on tin whisker growth显示文摘	FUKUDA Y OSTERMAN M PECHT M	2006	IEEE Transactions on Electronics Packaging Manufacturing2006，29，4：	1
10	Effect of Ag particle size on electrical conductivity of isotropically conductive adhesives 显示文摘	Lilei Y Zonghe L Johan L	1999	Electronics Packaging Manufacturing IEEE Transactions on1999，22，4：	1
11	Micropositioning of a weakly calibrated microassembly system using coarse-to-fine visual servoing strategies显示文摘	Vikramaditya B Nelson B J	2000	IEEE Transactions On Electronics Packaging Manufacturing2000，23，2：	1
12	Length distribution analysis for tin whisker growth显示文摘	FUKUDA Y OSTERMAN M PECHT M	2007	IEEE Transactions on Electronics Packaging Manufacturing2007，30，1：	1
13	Off-line control time-pressure dispensing process for electronics packaging显示文摘	Chen X B Zhang W J Shoenau G	2003	IEEE Transactions on Electronics Packaging Manufacturing2003，26，4：	1
14	Conductivity mechanisms of isotropic conductive adhesives (ICAs)显示文摘	Lu D Tong Q K Wong C P	1999	IEEE Transactions on Electronics Packaging Manufacturing1999，22，3：	1
15	Solder joint reliability in electronics under shock and vibration using explicit finiteelement submodeling 显示文摘	Pradeep L Sameep G Prakriti C	2007	IEEE transactions on electronics packaging manufacturing2007，30，1：	1
16	A Neural-Network Approach for Defect Recognition in TFT-LCD Photolithography Process 显示文摘	CHEN Li-fei SU Chao-tong CHEN Meng-heng	2009	IEEE Transactions on Electronics Packaging Manufacturing(S1521-334X)2009，32，1：	1
17	Rough set theory: a data mining tool for semiconductor manufacturing显示文摘	KUSIA A	2001	IEEE Transactions on Electronics Packaging Manufacturing2001，24，1：	1
18	Solder joints inspection using a neural network and fuzzy rule-based classification method显示文摘	KO K W CHO H S	2000	IEEE Transactions on Electronics Packaging Manufacturing2000，23，2：	1
19	Reducing solder paste inspection in surface-mount assembly through mahalanobis-taguchi analysis显示文摘	Huang J C Y	2010	IEEE Transactions on Electronics Packaging Manufacturing2010，33，4：	1
20	Electrode sticking during micro-resistance welding of thin metal sheets显示文摘	Dong S J Kelkar G P Zhou Y	2002	IEEE Transactions on Electronics Packaging Manufacturing2002，25，4：	1

返回顶部每页显示：

共10页首页上一页第1页下一页末页 /10 跳转

互联网出版许可证新出网证(渝)字10号全国400电话 - 免长途话费

用户提示