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227篇 您的检索式：期刊名="Component Hybrids Manufacturing Technology"

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	题名	作者	年代	出处	被引量
1	Micromechatronics and the miniaturization of structures, devices, and systems, Components, Packaging, and Manufacturing Technology(Part C)显示文摘	Friedrich CR Fang J Warrington RO	1997	IEEE Transactions on Components Hybrids and Manufacturing Technology1997，20，：	2
2	Process-based cost modeling显示文摘	BLOCH C RANGANATHAN R	1992	IEEE Transaction on Components Hybrids and Manufacturing Technology1992，15，3：	1
3	Edward modeling of two-dimensional spiral inductors显示文摘	M Dishman John T Dickens Fred W Whelan	1980	IEEE Transactions on Components Hybrids and Manufacturing Technology1980，3，4：	1
4	S-parameter based IC interconnect transmission line characterization显示文摘	EISENSTADT W R Eo Y	1992	IEEE Transactions on Components Hybrid Manufacturing Technology1992，15，：	1
5	Sliding wear of metallic contacts显示文摘	M Antler	1981	IEEE Trans Components Hybrids and Manufacturing Technology IEEE Sociiety1981，4，1：	1
6	Solder joint crack propagation analysis of wafer level chip scale package on printed circuit board assemblies 显示文摘	Lau J H Chang C Lee S W R	2001	Component Hybrids Manufacturing Technology2001，24，2：	1
7	Thermal stresses in aluminum lines bonded to substrates显示文摘	SAUTER A I NIX W D	1992	IEEE Transactions on Components Hybrids and Manufacturing Technology1992，15，4：	1
8	Fatigue of 60/40 Solder 显示文摘	Solomon H D	1986	IEEE Transactins on Components Hybrids and Manufacturing Technology1986，9，4：	1
9	Steady-state thermal conductivity measurements of AlN and SiC substrate materials 显示文摘	DETTMER E S ROMENESKO B M CHARLES JR H K	1989	Components Hybrids and Manufacturing Technology IEEE Transactions on1989，12，4：	1
10	Fatigue life of leadless chip carrier solder joint during power cycling显示文摘	Engelmaier W	1984	Component Hybrids Manufacturing Technology1984，6，3：	1
11	Constitutive relation and creep fatigue life model for eutectic tin-lead solder显示文摘	Knecht S Fox L R	1990	Components Hybrids and Manufacturing Technology1990，13，2：	1
12	A creep rupture model for two-phase eutectic solders显示文摘	Wong B Helling D E Clark R W	1998	IEEE Transactions on Components Hybrids and Manufacturing Technology1998，11，3：	1
13	Generic Reliability Figures of Merit Design Tools for Surface Mount Solder Attachments显示文摘	Engelmaier W	1993	IEEE Transactins on Components Hybrids and Manufacturing Technology1993，16，1：	1
14	Electric contact materials and their erosion in automotive DC relays显示文摘	Chi H Leung Anthony Lee	1992	IEEE Transaction on Components Hybrids and Manufacturing Technology1992，15，2：	1
15	Design consideration in high temperature analog CMOS integrated circuits 显示文摘	SHOUCAIR F S	1986	IEEE Trans Components Hybrids and Manufacturing Technology1986，9，3：	1
16	The gas-tightness of separable base metal electric contacts显示文摘	TRIPP J H GARTE S	1981	Components Hybrids and Manufacturing Technology IEEE Transactions on1981，4，1：	1
17	Knowledge-based control of adhesive dispensing for surface mount device assembly 显示文摘	Chandraker R West A A Williams D J	1990	IEEE Transactions on Components Hybrids and Manufacturing Technology1990，13，3：	1
18	A Fracture Mechanics Approach to Thermal Fatigue Life Prediction of Solder Joints 显示文摘	Pao Y H	1992	IEEE Transactins on Components Hybrids and Manufacturing Technology1992，15，4：	1
19	Fatigue of 60/40 solder 显示文摘	Solomon H D	1986	IEEE trans components hybrids manufacturing technology1986，9，4：	1
20	Composite solders 显示文摘	MARSHALL J L CALDERON J SEES J LUCEY G HWANG J S	1991	IEEE Transactions on Components Hybrids and Manufacturing Technology1991，14，4：	1

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