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179篇 您的检索式：期刊名="IEEE Transactions on Components Hybrid Manufacturing Technology"

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	题名	作者	年代	出处	被引量
1	Micromechatronics and the miniaturization of structures, devices, and systems, Components, Packaging, and Manufacturing Technology(Part C)显示文摘	Friedrich CR Fang J Warrington RO	1997	IEEE Transactions on Components Hybrids and Manufacturing Technology1997，20，：	2
2	Process-based cost modeling显示文摘	BLOCH C RANGANATHAN R	1992	IEEE Transaction on Components Hybrids and Manufacturing Technology1992，15，3：	1
3	Edward modeling of two-dimensional spiral inductors显示文摘	M Dishman John T Dickens Fred W Whelan	1980	IEEE Transactions on Components Hybrids and Manufacturing Technology1980，3，4：	1
4	S-parameter based IC interconnect transmission line characterization显示文摘	EISENSTADT W R Eo Y	1992	IEEE Transactions on Components Hybrid Manufacturing Technology1992，15，：	1
5	Thermal stresses in aluminum lines bonded to substrates显示文摘	SAUTER A I NIX W D	1992	IEEE Transactions on Components Hybrids and Manufacturing Technology1992，15，4：	1
6	Steady-state thermal conductivity measurements of AlN and SiC substrate materials 显示文摘	DETTMER E S ROMENESKO B M CHARLES JR H K	1989	Components Hybrids and Manufacturing Technology IEEE Transactions on1989，12，4：	1
7	A creep rupture model for two-phase eutectic solders显示文摘	Wong B Helling D E Clark R W	1998	IEEE Transactions on Components Hybrids and Manufacturing Technology1998，11，3：	1
8	Electric contact materials and their erosion in automotive DC relays显示文摘	Chi H Leung Anthony Lee	1992	IEEE Transaction on Components Hybrids and Manufacturing Technology1992，15，2：	1
9	The gas-tightness of separable base metal electric contacts显示文摘	TRIPP J H GARTE S	1981	Components Hybrids and Manufacturing Technology IEEE Transactions on1981，4，1：	1
10	Knowledge-based control of adhesive dispensing for surface mount device assembly 显示文摘	Chandraker R West A A Williams D J	1990	IEEE Transactions on Components Hybrids and Manufacturing Technology1990，13，3：	1
11	Composite solders 显示文摘	MARSHALL J L CALDERON J SEES J LUCEY G HWANG J S	1991	IEEE Transactions on Components Hybrids and Manufacturing Technology1991，14，4：	1
12	Fatigue life of leadless chip carrier solder joints during power cycling显示文摘	Engelmaier W	1983	IEEE Transactions on components Hybrids and Manufacturing Technology1983，6，3：	1
13	Correlation of analytical and experimental approaches to determine thermally induced PWB warpage显示文摘	Chao P Y Charles U Robert E	1993	IEEE Transactions on Components Hybrids and Manufacturing Technology1993，16，8：	1
14	High - accuracy die - bonding technology for LED array显示文摘	Tanabe H Shibata I Nihei K Miyaki K	1985	IEEE Transactions on Components Hybrids and Manufacturing Technology1985，8，4：	1
15	Constitutive relation and creep fatigue life model for eutectic tin-lead solder显示文摘	Knecht S Fox L R	1990	IEEE Transaction on Components Hybrids and Manufacturing Technology1990，13，2：	1
16	A Weibull model to characterize lifetimes of aluminum allov electrical wire connections显示文摘	Joyce C F	1991	IEEE Transactions on Components Hybrids and Manufacturing Technology1991，14，1：	1
17	Electrical contact bounce in medium-duty contacts 显示文摘	McBride J W	1989	IEEE Transactions on Components Hybrids and Manufacturing Technology1989，12，1：	1
18	Relay life tests with contact resistance measurement after each operation显示文摘	RIEDER W F STROF T W	1991	IEEE Transactions on Components Hybrids and Manufacturing Technology1991，14，1：	1
19	Forming feedthroughs in laser-drilled holes in semiconductor wafer by double-sided sputtering显示文摘	Thomas R Anthony	1982	IEEE Transactions on Components Hybrids and Manufacturing Technology1982，，5：	1
20	Metallurgical aspects of silver-based contact materials in air-Break switching devices for power engineering显示文摘	Roland Mchal Karl E Saeger	1989	IEEE Transactions on Components Hybrids and Manufacturing Technology1989，12，：	1

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