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18篇 您的检索式：期刊名="IEEE trans components hybrids manufacturing technology"

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		题名	作者	年代	出处	被引量
	1	Sliding wear of metallic contacts显示文摘	M Antler	1981	IEEE Trans Components Hybrids and Manufacturing Technology IEEE Sociiety1981，4，1：	1
	2	Design consideration in high temperature analog CMOS integrated circuits 显示文摘	SHOUCAIR F S	1986	IEEE Trans Components Hybrids and Manufacturing Technology1986，9，3：	1
	3	Fatigue of 60/40 solder 显示文摘	Solomon H D	1986	IEEE trans components hybrids manufacturing technology1986，9，4：	1
	4	Thermal analysis of integrated circuit devices and packages 显示文摘	LEE C C PALISOC A L MIN Y J	1989	IEEE Trans Components Hybrids and Manufacturing Technology1989，12，4：	1
	5	Thermal characteriza- tion of plastic small outline transistor(SOT)packages显示文摘	Mahalingham M M Andrews J A	1986	IEEE Trans on Components Hybrids and Manufacture Technology1986，9，4：	1
	6	A possible degeneration mechanism in stationary electrical contacts 显示文摘	TIMSIT R S	1990	IEEE Trans on Components Hybrids and Manufacturing Technology1990，13，1：	1
	7	Shear deformation of indium solder joints 显示文摘	DARVEAUX R TURLIK I	1990	IEEE Trans on Components Hybrids and Manufacturing Technology1990，13，4：	1
	8	Dynamic model of stationary contacts based on random variations of surface features 显示文摘	MALUCCI R D	1992	IEEE Trans on Components Hybrids and Manufacturing Technology1992，15，3：	1
	9	Fatigue of 60/40 solder 显示文摘	Solomon H D	1986	IEEE trans Components hybrids manufacturing technology1986，9，4：	1
	10	Modeling of Two-dimensional Spiral Inductors显示文摘	Robert Rodriguez Dishman John M Dickens Fred T and Whelan Edward W	1980	IEEE Trans on Components Hybrids and Manufacturing Technology CHMT-3 (4)1980，1980，：	1
	11	SoLder joint crack propagation analysis of wafer level chip scale package on printed circuit board assemblies显示文摘	CHANG C LEE S W R	2001	IEEE Tran Saction on Component Hybrid and Manufacturing Technology2001，24，2：	1
	12	Reliability of Commercial Relay during Life Test at Low Electrical Contact Load显示文摘	PIEDER W F STROF T W	1992	IEEE Trans on Components Hybrids and Manufacturing Technology1992，15，2：	1
	13	Reliability in large area solder Joint assemblies and effects of thermal expansion mismatch and die size显示文摘	FROST H J HOWARD R T LAVERY P R	1998	IEEE Trans Components Hybrids and Manufacturing Technology1998，11，4：	1
	14	High-speed VLSI Interconnect Modeling Based on S-Parameter Measurement显示文摘	Eo Y Eisenstadt W R	1993	IEEE Trans on Components Hybrids and Manufacturing Technology1993，16，5：	1
	15	Extension of high temperature electronics显示文摘	Draper B L Palmer D W	1979	IEEE Trans Components Hybrids Manufacturing Technology1979，2，4：	1
	16	An experimental investigation of contact bounce in medium duty contacts显示文摘	John W McBride	1991	IEEE Trans on components hybrids and manufacturing technology1991，14，2：	1
	17	Reliability of Commercial Relays During life Test at Low Electrical Contact Load显示文摘		1992	IEEE Trans on Components Hybrids and Manufacturing Technology1992，15，2：	1
	18	Silver-metal oxids a contact materials 显示文摘	Schroder K H	1987	IEEE Trans Components Hybrids Manufacturing Technology1987，10，1：	1

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