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75篇 您的检索式：作者名="Tippur"

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	题名	作者	年代	出处	被引量
1	Numerical analysis of crack-tip fields in functionally graded materials with a crack normal to the elastic gradient显示文摘	Marur P R Tippur H V	2000	International Journal of Solids and Structures2000，37，：	1
2	Dynamic fracture of compositionally graded materials with cracks along the elastic gradient: experiments and analysis 显示文摘	ROUSSEAU C E TIPPUR H V	2001	Mechanics of Materials2001，33，：	1
3	Dynamic fracture of graphite/epoxy composites stiffened by buffer strips: An experimental study显示文摘	Dongyeon Lee Hareesh Tippur Phillip Bogert	2012	Composite Structures2012，，：	1
4	Compositionally graded materials with cracks normal to the elastic gradient显示文摘	Rouseau C E Tippur H V	2000	Acta Materialia2000，48，16：	1
5	Mixed-mode dynamic crack growth in functionally graded glass-filled epoxy显示文摘	Kiruglige M S Tippur H V	2006	Experimental Mechanics2006，46，2：	1
6	Dynamic fracture of compositionally graded materials with cracks along the elastic gradient:Experiment and analysis显示文摘	Rouseau C E Tippur H V	2001	Mechanics of Materials2001，33，7：	1
7	Role of inclusion stiffness and interfacial strength on dynamic matrix crack growth: An experimental study显示文摘	Jajam K C Tippur H V	2012	International Journal of Solids and Structures2012，49，9：	1
8	Influence of elastic variations on crack initiation in functionally graded glass-filled epoxy显示文摘	Rouseau C E Tippur H V	2002	Engineering Fracture Mechanics2002，69，1416：	1
9	Numerical analysis of crack-tip fields in functionally graded materials显示文摘	Marur P R Tippur H V	2000	International of Solids and Structures2000，37，：	1
10	Evaluation of Elastic-Plastic Interfacial Fracture Parameters in Solder-Copper Bimaterial Using Moire Interferometry 显示文摘	Krishnamoorthy H Tippur H V	1998	Journal of Electronic Packaging1998，120，3：	1
11	Measurement of transient deformationsusing digital image correlation method andhigh-speed photography:application to dynamic fracture显示文摘	MADHU S KIRUGULIGE HAREESH V TIPPUR THOMAS S DENNEY	2007	Applied Optics2007，46，22：	1
12	Processing,compression resiponse and finite element modeling of syntactic foam based interpenetrating phase ccanposite ( IPC )显示文摘	Rahul Jhaver Hareesh Tippur	2009	Materials Science and Engineering A2009，，499：	1
13	A study of crack - inclusion interactions and matrix inclusion debonding using moir interferometry and finite element method显示文摘	P C Savalia H V Tippur	2007	Experimental Mechanics2007，47，5：	1
14	Measurement of transient deformations using digital image correlation method and high-speed photography:application to dynamic fracture显示文摘	MADHU S KIRUGULIGE HAREESH V TIPPUR THOMAS S DENNEY	2007	Applied Optics2007，46，22：	1
15	Coherent gradient sensor for crack tip deformation measurements:analysis and experimental results显示文摘	Tippur H V Krishnaswamy S Rosakis A J	1991	International Journal of Fracture1991，48，3：	1
16	Coherent gradient sensor for crack tip deformation measurements:analysis and experimental results显示文摘	Tippur H V Krishnaswamy S Rosakis A J	1991	International Journal of Fracture1991，48，3：	1
17	An experimental investigation of dynamic crack growth past a stiff inclusion显示文摘	K.C. Jajam H.V. Tippur	2011	Engineering Fracture Mechanics2011，，6：	1
18	Processing, compression response and finite element modeling of syntactic foam based interpenetra- ting phase composite显示文摘	Jhaver R Tippur H	2009	Mater Sei Eng A2009，499，：	1
19	Fracture parameter for interface cracks:an experimental-finite element study of crack tip fields and crack initiation toughness显示文摘	Xu L Tippur H V	1995	International Journal of Fracture1995，71，：	1
20	Dynamic fracture behavior of syntactic epoxy foams:Optical measurements using coherent gradient sensing显示文摘	Hadek E Medhat A Tippur Hareesh V	2003	Optics and Lasers in Engineering2003，40，4：	1

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