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13篇 您的检索式:作者名="Stefanka"
    题名 作者 年代 出处 被引量
1Dynamic Mechanical and Thermal Properties of Modified Poly(Propylene) Wood Fiber (Wood/PVC) Composites显示文摘Velichko H Stefanka V 0,,10:1
2Speciation of Se(Ⅳ)and the selenoamino acids by high-performance liquid chromatography -direct hydride generation-atomic fluorescence spectrometry显示文摘Ipolyi I Stefanka Z S 2001Analytica Chimica Acta2001,435,:1
3Novel separation method for highly sensitive speciation of cancerostatie platinum compounds by HPLC-ICP-MS 显示文摘Hann S Stefanka Z Lenz K 2005Anal Bioanal Chem2005,381,2:1
4Speciation of Se ( Ⅳ ) and the selenoaminoacids by high-performance liquid chromatography–direct hydridegeneration0atomic fluorescence spectrometry显示文摘Ipolyi I Stefanka Z 2001AnalyticaChimica Acta2001,538,36:1
5Dynamic mechanical and thermal properties of modified poly(propylene) wood fiber composites显示文摘Velichko H Stefanka V 2003Macromole Materi Engi2003,228,10:1
6Dynamic mechanical and thermal properties of modified poly(propylene) wood fiherwood/PVC composites显示文摘Velichko H Stefanka V 2003Macromole Materi Engi2003,228,10:1
7On optimal replacement-repair policy for multi-state deteriorating products under renewing free replacement warranty显示文摘Hashem Vahdani Stefanka Chukova Hashem Mahlooji 2010Computers and Mathematics with Applications2010,,4:1
8Dynamic mechanical and thermal properties of modified poly(propylene) wood fiberwood/PVCcomposites显示文摘Velichko H Stefanka V 2003Macromole Materi Engi2003,228,10:1
9Maintenance models in warranty: A literature review显示文摘Mahmood Shafiee Stefanka Chukova 2013European Journal of Operational Research2013,,3:1
10Dynemic mechanical and thermal properties of modified poly(propylene) wood fiber composites显示文摘Velichko H Stefanka V 2003Macromole Materi & Engi2003,228,10:1
11Determination of the geographical origin of processed spice using multielement and isotopic pattern on the example of Szegedi paprika 显示文摘Brenner M Katona R Stefanka Z et al 2010Eur Food2010,,2010:1
12Dynamic mechanical and thermal proper- ties of modified poly(propylene) wood fiber composites显示文摘Velichko H Stefanka V 2003Mac- romolecular Materials and Engineering2003,,288:1
13PCI总线至ATM的接口显示文摘单片系统解决方案(System on chip)是所有工程师的梦想。第一个可编程器件(PAL)的出现,为实现这个梦想跨出了第一步。当密度更高、容量更大的FPGA面世时,似乎梦想已成为现实。然而,随着技术的发展,市场对更高频率的需求也不断增加,具有通用结构的FPGA已无法提供所需的性能,目前专用芯片(ASIC)似乎成了唯一的解决方案。不过市场上已出现了被称为内置标准模块芯片(ESP)的新一代产品,这类产品具有ASIC的性能以及FPGA的灵活性。由于标准功能块被置入FPGA的逻辑单元之间,ESP产品为设计人员提供了极大的灵活性。Quicklogic公司的QL5064就是其中一个产品,它属于该公司的OuickPCI系列。Stefanka kitanovska 1999世界电子元器件1999,,11:0
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