| 6 | The effects of pressure, temperature, and depth/diameter ratio on the microvia filling performance of Ag-coated Cu micro-nanoparticles for advanced electronic packaging显示文摘Conductive fillers made from metal nanoparticles offer many advan-tages for the fabrication of a variety of electronic devices,but when they have a porous structure,their poor conductivity limits their adoption in many applications.In this study,an Ag-coated Cu micro-nanoparticle paste is used to achieve compact filling of blind vias on flexible copper clad polyimide laminates through a multistep filling and sintering tech-nique.The filled blind vias achieve a resistivity as low as 6.2μΩ·cm,which is comparable that of electroplated blind vias.Higher sintering pressure and temperature promote the filling performance,while the conductivity deteriorates at a via depth/diameter ratio greater than 1:1.Finite element simulations reveal a stress inhomogeneity in vias with large depth/diameter ratios,which is the key to understanding the evolution of the conductive properties of a paste-filled via.This study provides an effective method for high-performance microvia filling as well as insights into the mechanism that influences its performance. | Guannan Yang Shaogen Luo Bo Luo Yan Zuo Shiwo Ta Tingyu Lin Zhaohui Zhao Yu Zhang Chengqiang Cui | 2022 | International Journal of Smart and Nano Materials2022，13，4： | 0 |
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