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15篇 您的检索式：作者名="STAVREVA Z"

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		题名	作者	年代	出处	被引量
	1	Influence of Process Parameter on Chemical Mechanical Polishing of Copper显示文摘	Z Stavreva D Zeidler M Plotner	1997	Microelectronic Engineering1997，3738，：	1
	2	Characteristics in chemical-mechanical polishing of copper: Comparison of polishing pads 显示文摘	STAVREVA Z ZEIDLE D PLOTNER M	1997	Applied Surface Science1997，108，2：	1
	3	Characterization of Cu chemical polishing by electrochemical investigations显示文摘	D Zeidler Z Stavreva M Ploner	1997	Microelectronic Engineering1997，33，：	1
	4	The Interaction Between Different Barrier Metals and the Copper Surface during the Chemical Mechanical Polishing显示文摘	D Zeidler Z Stavreva M Plotner	1997	Microelectronic Engineering1997，3738，：	1
	5	Characteristics in chemical mechanical polishing of copper: comparison of polishing pads显示文摘	Stavreva Z Zeidler D	1997	Applied Surface Science1997，108，：	1
	6	Chemical mechanical polishing of copper for multilevel metallization显示文摘	Stavreva Z Zeidler D Plotner M	1995	Applied Surface Science1995，91，：	1
	7	Characterizationof Cu chemical mechanical polishing by electrochemicalinvestigations显示文摘	Zeidler D Stavreva Z Plotner M	1997	Microelectronic Engineering1997，33，14：	1
	8	Chemical mechanical polishing of copper for multilevel metallization显示文摘	STAVREVA Z ZEIDLER D PLOTNER M	1995	Applied Surface Science1995，91，：	1
	9	Characteristics inchemical mechanical polishing of copper: comparison ofpolishing pads 显示文摘	Stavreva Z Zeidler D Plotner M	1997	Applied Surface Science1997，108，1：	1
	10	Characterization of Cu chemical mechanical polishing by electrochemical investigations 显示文摘	ZEIDLER D STAVREVA Z PLOTNER M	1997	Microelectronic Engineering1997，33，：	1
	11	Chemical polishing of copper for multilevel metallization显示文摘	STAVREVA Z ZEIDLER D PLOTNER Metal	1995	Applied Surface Science1995，，91：	1
	12	Characterization of Cu chemical polishing by electrochemical investigations显示文摘	Zeidler D Stavreva Z Ploner M	1997	Microelectronic Engineering1997，33，：	1
	13	The interaction between different barrier metals and the copper surface during the chemical mechanical polishin 显示文摘	Zeidler D Stavreva Z Plotner M	1997	Microelectronic Engineering1997，3738，：	1
	14	Characterization of Cu chemical mechanical polishing by electrochemical investigations 显示文摘	Zeidler D Stavreva Z Plotner M	1997	Microelectronic Engineering1997，33，：	1
	15	Characteristics in chemical mechanical polishing of copper:comparison of polishing pads显示文摘	Stavreva Z Zeidler D	1997	Applied Surface Science1997，108，：	1

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