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20篇 您的检索式：作者名="M Plotner"

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	题名	作者	年代	出处	被引量
1	Influence of Process Parameter on Chemical Mechanical Polishing of Copper显示文摘	Z Stavreva D Zeidler M Plotner	1997	Microelectronic Engineering1997，3738，：	1
2	Influence of process parameters on chemical-mechanical polishing of copper 显示文摘	STAVREZA Z ZIDLER D PLOTNER M	1997	Microelectronic Engineering1997，37，38：	1
3	Characteristics in chemical-mechanical polishing of copper: Comparison of polishing pads 显示文摘	STAVREVA Z ZEIDLE D PLOTNER M	1997	Applied Surface Science1997，108，2：	1
4	The Interaction Between Different Barrier Metals and the Copper Surface during the Chemical Mechanical Polishing显示文摘	D Zeidler Z Stavreva M Plotner	1997	Microelectronic Engineering1997，3738，：	1
5	Influence of process parameters on chemical mechanical polishing of copper显示文摘	STAVRAVA Z ZEIDLER D PLOTNER M	1997	Microelectronic Engineering1997，3738，：	1
6	Chemical mechanical polishing of copper for multilevel metallization显示文摘	Stavreva Z Zeidler D Plotner M	1995	Applied Surface Science1995，91，：	1
7	Characterizationof Cu chemical mechanical polishing by electrochemicalinvestigations显示文摘	Zeidler D Stavreva Z Plotner M	1997	Microelectronic Engineering1997，33，14：	1
8	Endpoint detection method for CMP of copper显示文摘	ZEIDLE R D PLOTNER M DRESCHER K	2000	Microelectronic Engineering2000，50，：	1
9	Photo cross-linkable poly(N-isopropylacryamide) copolymer Ⅲ:micro-fabricated temperature responsive hydrogels显示文摘	Kuckling D Hoffmann J Plotner M	2003	Polymer2003，，44：	1
10	Photopatterning of thermally sensitive hydrogels useful for microactuators显示文摘	Hoffmann J Plotner M Kuckling D	1999	Sensor and Actuator1999，，77：	1
11	Chemical mechanical polishing of copper for multilevel metallization显示文摘	STAVREVA Z ZEIDLER D PLOTNER M	1995	Applied Surface Science1995，91，：	1
12	A molecular phylogeny of Scrippsiella sensu lato(Calciodinellaceae,Dinophyta) with interpretations on morphology and distribution显示文摘	Gottschling M Knop R Plotner J	2005	European Journal of Phycology2005，40，2：	1
13	Characteristics inchemical mechanical polishing of copper: comparison ofpolishing pads 显示文摘	Stavreva Z Zeidler D Plotner M	1997	Applied Surface Science1997，108，1：	1
14	Phylogeny of calcareous dinoflagellates as inferred from ITS and ribosomal sequence data显示文摘	GOTTSCHLING M KEUPP H PLOTNER J	2005	Mol Phylogene Evol2005，36，3：	1
15	Characterization of Cu chemical mechanical polishing by electrochemical investigations 显示文摘	ZEIDLER D STAVREVA Z PLOTNER M	1997	Microelectronic Engineering1997，33，：	1
16	Influence of process parameters on chemical-mechanical polishing of copper显示文摘	STAVREZA Z ZIDLER D PLOTNER M	1997	Micro- electronic Engineering1997，37，38：	1
17	Combined hinge and nasolabial transposition flap for repair of a full-thickness nasal alar defect显示文摘	PLOTNER A N GLOSTER H M Jr	2011	Dermatol Surg2011，37，3：	1
18	The interaction between different barrier metals and the copper surface during the chemical mechanical polishin 显示文摘	Zeidler D Stavreva Z Plotner M	1997	Microelectronic Engineering1997，3738，：	1
19	Characterization of Cu chemical mechanical polishing by electrochemical investigations 显示文摘	Zeidler D Stavreva Z Plotner M	1997	Microelectronic Engineering1997，33，：	1
20	Influence of process parameters on chemical-mechanical polishing of copper显示文摘	STAVREZA Z ZIDLER D PLOTNER M	1997	Microelectronic Engineering1997，3738，：	1

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