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21篇 您的检索式：作者名="S Shingubara"

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	题名	作者	年代	出处	被引量
1	Fabrica-tion of nanohole array on Si using self-organized porous alumina mask显示文摘	SHINGUBARA S OKINO O MURAKAMI Y	2001	J Vac Sci Technol:B2001，19，5：	1
2	Bottom-up fill of copper in deep submicrometer holes by electroless plating 显示文摘	SHINGUBARA S WANG Z L YAEGASHI O	2004	Electrochemical and Solid-State Letters2004，7，6：	1
3	显示文摘	Shingubara S	2003	J Nanoparticle Research2003，5，：	1
4	显示文摘	Shingubara S Okino O Sayama Y	1997	Jpn J Appl Phys1997，36，12：	1
5	Self-Organization of a sulfuric/oxalic acid mixture as electrolyte显示文摘	Shingubara S Morimoto K Sakaue H	2004	Electrochemical and Solid-State Letters2004，7，3：	1
6	Two - dimensional nanowire army formation on Si substrate using self- organized nanoholes of anodically oxidized aluminum显示文摘	S Shingubara O Okino Y Sakaue T Takahagi	1999	Solid - State Electronics1999，43，：	1
7	Self- Organization of a Sulfuric/Oxalic Acid Mixture as Electrolyte显示文摘	Shingubara S Morimoto K Sakaue H	2004	Electrochemical and Solid State Letters2004，7，3：	1
8	Fabri cation of nanohole array on Si using self-organized porous alu mina mask 显示文摘	SHINGUBARA S OKINO O MURAKAMI Y	2001	J Vac Sci Technol:B2001，19，5：	1
9	Fabrication of nanomaterials using porous alumina templates显示文摘	SHINGUBARA S		0，，：	1
10	Fabrication of nanomaterials using porous alumina templates显示文摘	Shingubara S	2003	NanopartRes2003，5，12：	1
11	Bottom-up fill of copper in deep sub micrometer holes by electro less plating显示文摘	SHINGUBARA S WANG Z YAEGASHI O	2004	Electrochemical and Solid-State Letters2004，7，6：	1
12	Fabrication of nanomaterials using porous alumina templates显示文摘	SHINGUBARA S	2003	Journal of Nanoparticle Research2003，5，12：	1
13	Formation of aluminum nanodot array by combination of nanoindentation and anodic oxidation of aluminum显示文摘	Shingubara S Murakami Y Morimoto K	2003	Surface Science2003，，532535：	1
14	Bottom-up fill of copper in deep submicrometer holes by electroless plating 显示文摘	SHINGUBARA S WANG Z L YAEGASHI O	2004	Electrochem Solid-State Lett2004，7，6：	1
15	Fabrication of nanomaterials using porous alumina templates显示文摘	Shingubara S	2003	Nanopart Res2003，5，12：	1
16	Formation and film characteristics of dual damascene interconnects by bottom-up electroless Cu plating 显示文摘	SHINGUBARA S WANG Z L	2006	AIP Conference Proceedings2006，817，1：	1
17	显示文摘	Shingubara S Okino O Sayama Y	1997	J Appl Phys1997，36，：	1
18	Fabrication of nanomaterials using porous alumina templates 显示文摘	SHINGUBARA S	2003	J Nanopart Res2003，5，：	1
19	Influence of surface oxide of sputtered TaN on displacement plating of Cu 显示文摘	WANG Zeng-lin SAKAUE H SHINGUBARA S TAKAHAGI T	2003	Japanese Journal of Applied Physics B2003，42，4：	1
20	Fabrication of nanomaterials using porous alumina templates 显示文摘	Shingubara S	2003	Nanopart Res2003，5，12：	1

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