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69篇 您的检索式：作者名="PRITZKER M"

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	题名	作者	年代	出处	被引量
1	The Role of Osteoprotegerin and Tumor Necrosis Factor-related Apoptosis-inducing Ligand in Human Microvascular Endothelial Cell Survival 显示文摘	Pritzker LB Scatena M Giachelli CM	2004	Mol Biol cell2004，15，6：	1
2	Mechanistic modeling of a cathode supported tubular solid oxide fuel cell显示文摘	SUWANWARANGKUL R CROISET E PRITZKER M D	2006	J Power Sources2006，154，：	1
3	Mechanistic modelling of a cathode-supported tubular solid oxide fuel cell显示文摘	SUWANWARANGKUL R CROISET E PRITZKER M D	2006	Power Source2006，154，1：	1
4	Study of the effect of temperature on Pt dissolution in polymer electrolyte membrane fuel cells via accelerated stress tests显示文摘	DHANUSHKODI S R KUNDU S FOWLER M W PRITZKER M D	2014	J Power Sources2014，245，1：	1
5	Investigation of electroless plating of Ni-W-P alloy films显示文摘	N Du M Pritzker	2003	J Appl Electrochem2003，33，：	1
6	Effect of plating mode,thiourea and chloride on the morphology of copper deposits produced in acidic sulphate solutions显示文摘	TANTAVICHET N PRITZKER M D	2005	Electrochimica Acta2005，，50：	1
7	The role of osteoprotegerin and tumor necrosis factor-related apoptosis-inducing ligand in human microvascular endothelial cell survival显示文摘	Scatena M Giachelli C	2004	Molec Biol Cell2004，15，6：	1
8	The role of osteoprotegerin and tumor necmsis factor-related apoptosis-inducing ligand in human mierovascular endotheliad cell survival显示文摘	Pritzker LB Seatena M Giachelli CM	2004	Mol Biol Cell2004，15，6：	1
9	Mass transfer variation within a packed bed and its relation to liquid distribution 显示文摘	GOSTICK J PRITZKER M LOHI A	2004	Chem Eng J2004，100，123：	1
10	Effect of plating mode,thiourea and chloride on the morphology of copper deposits produced in acidic sulphate solutions显示文摘	Pritzker M	2005	Electrochimica Acta2005，50，：	1
11	Investigation of electroless plating of Ni-W-P alloy films 显示文摘	DU N PRITZKER M	2003	Journal of Applied Electrochemistry2003，33，：	1
12	The role of osteoprotegerin and tumor necrosis factor-related apoptosis-inducing ligand in human microvascular endothelial cell survival, 显示文摘	Pritzker LB Scatena M Giachelli CM	2004	Mol Biol Cell2004，15，6：	1
13	Investigation of electroless plating of Ni-W-P allos films 显示文摘	Du N Pritzker M	2003	Journal of Applied Electro-chemistry2003，33，：	1
14	The role of osteoprotegerin and tumor necrosis factor-related apoptosis-inducing ligand in human microvascular endothelial cell survival显示文摘	Pritzker LB Scatena M Giachelli CM	2004	Mol Biol cell2004，15，6：	1
15	Modeling the galvanostatic pulse and pulse reverse plating of nickel-iron alloys on a rotating disk electrode 显示文摘	Schultz H Pritzker M	1998	J Electrochem Soc1998，145，6：	1
16	Use of pervaporation for the separation of phenol from dilute aqueous solutions显示文摘	Hao X Pritzker M Feng X	2009	Journal of Membrane Science2009，335，12：	1
17	Use of pervaporation for the separation of phenol from dilute aqueous solutions显示文摘	Hao X G Pritzker M Feng X S	2009	J Membr Sci2009，335，12：	1
18	The role of osteoprotegerin and tumor necrosis factor-related apoptosis-inducing ligand in human microvascular endothelial cell survival显示文摘	Pritzker L B Scatena M Giachelli C M	2004	Mol Biol Cell2004，15，6：	1
19	Effect of plating mode, thiourea and chloride on the morphology of copper deposits produced in acidic sulphate solutions 显示文摘	TANTAVICHET N PRITZKER M	2005	Electrochimica Acta2005，50，9：	1
20	Vohammetric study of the in- hibition effect of polyethylene glycol and chloride ions on copper deposition 显示文摘	Garrido M E H Pritzker M D	2008	Journal of Electrochemical Society2008，155，4：	1

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