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15篇 您的检索式:作者名="MUNDLE R"
    题名 作者 年代 出处 被引量
1Influence of pattern void on hydroplaning and related target conflicts显示文摘Wies B Roeger B Mundl R 2009Tire Science and Technology2009,37,3:1
2Influence of Pattern Void onHydroplaning and Related Target Conflicts 显示文摘Wies B Roeger B Mundl R 2009Tire Science and Technology2009,37,3:1
3Sur- face plasmon excitation via Au nanoparticles in n-CdSe/ p-Si heterojunction diodes 显示文摘KONDA R B MUNDLE R MUSTAFA H 2007Appl Phys Lett2007,91,19:1
4An update on the new rheocasting development work for Al-and Mg-alloys 显示文摘Kaufmann H Mundl A Potzinger R 2002Die Casting Engineer2002,46,4:1
5Prescribing habits of physicians in Medical College,Calcutta显示文摘Biswas R Chatterjee P Mundle M 0,,04:1
6Friction Mechanism of Tread Blocks on Snow Surfaces显示文摘MUNDL R MESCHKELAND G LEDERER W 1997Tire Science and Technology1997,25,4:1
7An update on the new rheocasting development work for Al-and Mg-alloys显示文摘KAUFMANN H MUNDL A POTZINGER R 2002Die Casting Engineer2002,46,4:1
8Influence of pattern void on hydroplaning and related target conflicts 4显示文摘WIES B ROEGER B MUNDL R 2009Tire Science and Technology2009,37,3:1
9显示文摘Bamiduro O Mustafa H Mundle R 2007Applied Physics Letters2007,90,252108:1
10Influence of pattern void on hydroplaning and related target conflicts显示文摘WIES B ROEGER B MUNDL R 2009Tire Science andTechnology2009,37,3:1
11Vaginal misoprostol for induction of labor:8 randomized controlled trial显示文摘Mundle W R Young D C 1996Obstet Gynecol1996,,4:1
12Surfaceplasmon excitation via Au nanoparticles in n-CdSe/p-Si hetero-junction diodes显示文摘KONDA R B MUNDLE R MUSTAFA H 2007Applied Physics Letters2007,91,19:1
13Metal-like conductivity in transparent Al:ZnO films显示文摘BAMIDURO O MUSTAFA H MUNDLE R 2007Appl Phys Lett2007,90,:1
14Oralversus intravenous steroids in acute exacerbation ofasthma--randomized controlled study 显示文摘DEMBLA G MUNDLE R P SALKAR H R 2011J AssocPhysicians India2011,59,:1
15Evaluation of Tire Tread and Body Interactions in the Contact Patch显示文摘Koehne S Matute B Mundl R 2003Tire Science and Technology2003,31,3:1
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