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8篇 您的检索式：作者名="Hoofman"

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		题名	作者	年代	出处	被引量
	1	Impact of different slurry and polishing pad choices on the planarization efficiency of a copper CMP process显示文摘	Viet H. Nguyen Roel Daamen Romano Hoofman	2004	Microelectronic Engineering2004，，1：	1
	2	Impact of different slurry and polishing pad choices on the planarization efficiency of a copper CMP process 显示文摘	NGUYEN V H DAAMEN R HOOFMAN R	2004	Microelectronic Engineering2004，76，1234：	1
	3	Physiological basis of clinically used coronary hemodynamic indices 显示文摘	SPAAN JAE PIEK JJ HOOFMAN JIE et ol	2006	Circu- lation2006，113，3：	1
	4	Impact of different slurry and polishing pad choices on the pla- narization efficiency of a copper CMP process 显示文摘	Viet H Nguyen Roel Daamen Romano Hoofman	2004	Micro- electronic Engineering2004，76，：	1
	5	Impact of different slurry and polishing pad choices on the pIanarization efficiency of a copper CMP process显示文摘	NGUYEN V H DAAMEN R HOOFMAN R	2004	Microelectronic Engineering2004，76，：	1
	6	Impact ofdifferent slurry and polishing pad choices on theplanarization efficiency of a copper CMP process显示文摘	NGUYEN V H DAAMEN R HOOFMAN R	2004	Microelectronic Engineering2004，76，1234：	1
	7	Impact of dif- ferent slurry and polishing pad choices on the planarization effi ciency of a copper CMP process 显示文摘	NGUYEN V H DAAMEN R HOOFMAN R	2004	Microelectronic Enginee ring2004，76，1234：	1
	8	Impact of different slurry and polishing pad choices on the planarization efficiency of a copper CMP process显示文摘	Viet H. Nguyen Roel Daamen Romano Hoofman	2004	Microelectronic Engineering2004，，1：	1

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