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9篇 您的检索式:作者名="Goorsky"
    题名 作者 年代 出处 被引量
1Chemical Mechanical Polishing of CaN显示文摘Hayashi S Koga T Goorsky M S 2008J Electrochem Soc2008,155,2:1
2Synthesis of Si1-yGey alloys by molecular beam epitaxy 显示文摘Iyer S S Eberl K Goorsky M S 1992Appl Phys Lett1992,60,3:1
3Lattice tilt and relaxation in InGaP/GaAs/Ge solar cell on miscut substrates显示文摘Hess R R Moore C D Goorsky M S 1999J Phy D:Appl Phys1999,32,:1
4Reduction of the potential energy barrier and resistance at waferbonded n-GaAs/n-GaAs interface by sulfur passivation显示文摘JACKSON M J JACKSON B L GOORSKY M S 2011Journal of Applied Physics2011,110,10:1
5查看详情显示文摘Matney K Goorsky M S 0,,:1
6Investigation of the effects of polishing and etching on the quality of Cd1?xZnxTe using spatial mapping techniques显示文摘H. Yoon J. M. Scyoc M. S. Goorsky H. Hermon M. Schieber J. C. Lund R. B. James 1997Journal of Electronic Materials1997,,6:1
7The role of the low temperature buffer layer and layer thickness in the optimization of OMVPE growth of GaN on sapphire显示文摘S. D. Hersee J. Ramer K. Zheng C. Kranenberg K. Malloy M. Banas M. Goorsky 1995Journal of Electronic Materials1995,,11:1
8Influence of the Degreeof Order of InGaP on Its Hardness Determined Using NanoinDentation显示文摘Zakaria A Fetzer C M Goorsky M S 2010Journal of Applied Physics2010,108,07:1
9Study of the initial stage of electroless Ni deposition on Si(100)substrates in aqueous alkaline solution显示文摘Zhang X Ren F Goorsky M S 2006Slurface and Coating Technolo-gy2006,201,:1
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