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25篇 您的检索式：作者名="Engelmaier"

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	题名	作者	年代	出处	被引量
1	Fatigue lifo of leadless chip carder solder joints during power cycling 显示文摘	ENGELMAIER W	2003	Compon Hybrids Manuf Technol2003，6，3：	1
2	Fatigue life of leadless chip carrier solder joints during power cycling显示文摘	Engelmaier W	1983	IEEE Transactions on Com- ponents Hybrids and Manufacturing Technology1983，6，3：	1
3	Cementless acetabular reconstruction and structural bone-grafting in dysplastic hips显示文摘	HENDRICH C ENGELMAIER F MEHLING I	2007	J Bone Joint Surg Am2007，89，2：	1
4	Fatigue life of leadless chip carrier solder joint during power cycling显示文摘	Engelmaier W	1984	Component Hybrids Manufacturing Technology1984，6，3：	1
5	Generic Reliability Figures of Merit Design Tools for Surface Mount Solder Attachments显示文摘	Engelmaier W	1993	IEEE Transactins on Components Hybrids and Manufacturing Technology1993，16，1：	1
6	Fatigue life of leadless chip carrier solder joints during power cycling 显示文摘	Engelmaier W	1983	IEEE Trans CPMT1983，6，3：	1
7	How to specify reliable PCBs for lead-free solder assembly显示文摘	Werner Engelmaier	2006	Global SMT & Packaging2006，9，：	1
8	Fatigue life of leadless chip carrier solder joints during power cycling显示文摘	Engelmaier W	1983	IEEE Transactions on components Hybrids and Manufacturing Technology1983，6，3：	1
9	Fatigue life of leadless chip carrier solder joint during power cycling 显示文摘	Engelmaier W	1983	IEEE CHMT1983，6，3：	1
10	Fatigue life of leadless chip carrier solder joints during power cycling显示文摘	ENGELMAIER W		0，，3：	1
11	Fatigue life of leadless chip carrier solder joints during power cycling显示文摘		1986	IEEE Transaction on Component Hybrid and Manufacturing Technology1986，4，3：	1
12	Fatigue life of leadless chip carrier solder joints during power cycling显示文摘	Engelmaier W	1983	IEEE Transactions on Components Hy- brids and Manufacturing Technology1983，6，3：	1
13	Fatigue Life of Leadless Chip Carriers Sol- der Joints during Power Cycling显示文摘	ENGELMAIER W	1983	IEEE Trans CPMT1983，6，23：	1
14	Fatigue life of leadless chip carrier solder joints during power cycling显示文摘	Engelmaier W	1983	IEEE Transactions on Components Hybrids and Manufacturing Technology1983，6，3：	1
15	Fatigue life of leadless chip carrier solder joints during power cycling显示文摘	ENGELMAIER W	1983	IEEE Transactions on Components Hybrids and Manufacturing Technology1983，6，3：	1
16	The use environments of electronic assemblies and their impact on surface mount solder attachment reliability显示文摘	Engelmaier W	1990	IEEE Transactions on Components Hybrid and Manufacturing Technology1990，13，4：	1
17	Fatigue life of leadless chip carrier solder joints during power cycling显示文摘	Engelmaier W	1983	IEEE Transactions Technology1983，6，3：	1
18	Intravenous immunoglobulin (IVIG) Gammagard Liquid contains antiRAGE IGG and SLRP显示文摘	Weber A Engelmaier A Teschner H		0，，04：	1
19	Current distribution leveling resulting from auxiliary bipolar electrodes 显示文摘	Engelmaier W Kessler T Alkire R	1978	Journal of the Electrochemical Society1978，，2：	1
20	Fatigue life of leadless chip carrier solder joints during power cycling显示文摘		1983	IEEE trans CHMT1983，6，3：	1

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