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15篇 您的检索式:作者名="Apanius"
    题名 作者 年代 出处 被引量
1Silicon sha- dow mask fabrication for patterned metal deposition with mi- croscale dimensions using a novel corner compensation scheme显示文摘Matt Apanius Pankaj B Kaul Alexis R 2007Sens Actuators A2007,140,2:1
2The nature of selection on the major histocompatibility complex 显示文摘APANIUS V PENN D SLEV P R 1999Rev Immunol1999,17,2:1
3Serum immunoglobulin G levels in very old common terns Sterna hirundo 显示文摘Apanius V Nisbet I C 2003Exp Gerontol2003,38,7:1
4The nature of selection on the major histocompatibility complex显示文摘Apanius V Penn D Slev P 1997Critical Reviews in Immunology1997,17,:1
5The nature of selection on the major histocompatibility complex显示文摘Apanius V Penn D J Slev PR 0,,:1
6The nature of selection on the major histocompatibility complex显示文摘Apanius V Penn D Slev P 1997Crit Rev Immunol1997,17,:1
7The nature of selection on the majour histocompatibility complex显示文摘APANIUS V PENN D SLEV P 0,,:1
8Ecological correlates of single seededness in a woody tropical flora 显示文摘Casper BB Head SB Apanius V 1992Oecologia1992,,90:1
9Serum immunoglobulin G levels in very old common terns Sterna hirundo 显示文摘APANIUS V NISBET I C 2003E''xp Geronol2003,38,7:1
10The nature of selection on the major histocompatibility complex 显示文摘Apanius V Penn D Slev P R 1997Critical Reviews in Immunology1997,17,2:1
11The nature of selection on the major histocompatibility complex显示文摘APANIUS V PENN D SLEV P R 1997Critical Reviews in Immunology1997,17,2:1
12The nature of selection on the major histocompatibility complex显示文摘Apanius V Penn D Slev P R 1999Critical Review in Immunology1999,17,2:1
13The nature of selection on the majour histocompatibility complex显示文摘Apanius V Penn D Slev P 1997CriticalReviews in Immunology1997,17,:1
14The nature of selection on the major histocompatibility complex 显示文摘Apanius V Pennd Slev P R 1999Rev lmmunol1999,17,2:1
15不断发展的MEMS封装、装配和测试显示文摘因为封装/装配/测试可占到MEMS成本的60%,所以用新的方法来实施这些工艺对于商业化而言至关重要 历史上,在MEMS(微机电系统)整个成功商业化的进程中,封装/装配/测试(P/A/T)对于器件研发而言只占据着无关紧要的位置。最开始,MEMS实际上是独立的器件,它被插入到特别订制的机械外壳或标准IC封装中,并以随机的方式进行测试。Matt Apanius Roger H. Grace Leland 'CHIP' Spangler 2013今日电子2013,,8:0
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