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33篇 您的检索式：期刊名="Microelectronies Reliability"

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	题名	作者	年代	出处	被引量
1	Improving software reliability forecasting 显示文摘	Butschy B Albeanu G Boros D N	1997	Microelectronies and Reliability1997，37，6：	1
2	Time-series models for reliability evaluation of power systems including wind energy 显示文摘	Billinton R CHEN H GHAJAR R	1996	Microelectronies Reliability1996，，9：	1
3	Reliability model for Al wire bonds subjected to heel crack failures显示文摘	Ramminger S Seliger N Wachutka G	2000	Microelectroni s Reliability2000，40，：	1
4	Diagnosis of fully differential circuits based on a fault dictionary implemented in the microcontroller systems显示文摘	TOCZEK W CZAJA Z	2011	Microelectronies Reliability2011，51，8：	1
5	Wire bonding characteri- stics of gold conductors for low temperature co-fired ceramic applications 显示文摘	Lopez C Chai L Shaikh A	2004	Microelectronies Reliability2004，44，2：	1
6	On gemetric process and repair replacement problems 显示文摘	Stanley A D J	1993	Microelectronie and Reliablity1993，，33：	1
7	The role of dissolved hydrogen and other trace impurities on propensity of tin deposits to grow whiskers 显示文摘	PINSKY D A	2008	Microelectronies Reliability2008，48，5：	1
8	Reliability of vacuum packaged MEMS gyro scopes 显示文摘	CHOA S H	2005	Microelectronies Reliability2005，45，2：	1
9	Adhesive die attach for power applicalion: Performance and reliability in plastic package显示文摘	Tizinani R Passoni G Santospirito G	2002	Microelectronies Reliability2002，42，：	1
10	Comprehensive board-level solder joint reliability modeling and testing of QFN and power QFN packages 显示文摘	Tee T Y Ng H S Yap D	2003	Microelectronies Reliability2003，43，8：	1
11	Bus-invert coding for low power I/O 显示文摘	Stan M R Burleson W P	1996	Microelectronies Reliability1996，36，4：	1
12	Reliability improvement of fluorescent lamp using grey forecasting model 显示文摘	CHIAO C H WANG W Y	2002	Microelectronies Reliability2002，42，：	1
13	Thermal properties of diamond/ copper composite material 显示文摘	YOSHIDA K MORIGAMI H	2004	Microelectronies Reliability2004，44，2：	1
14	Development of process modeling methodology for flip chip on flex interconnections with non-conductive adhesives显示文摘	Zhang X W Wong E H Rajoo R	2005	Microelectronies Reliability2005，45，78：	1
15	Threshold voltage shift prediction for gate bias stress on amorphous InGaZnO thin film transistors 显示文摘	Park S Cho E N Yun I	2012	Microelectronies Reliability2012，52，9：	1
16	The characterization of e- \|eetrically conductive silver ink patterns on flexible substrates显示文摘	Merilampi S Laine-Ma T Ruuskanen P	2009	Microelectronies Reliability2009，49，7：	1
17	Some new results on one unit repairable system显示文摘	Tang Y H	1996	Microelectronies And Reliability1996，，36：	1
18	Bayesian techniques to reduce the sample size in automotive electronics attribute testing 显示文摘	Kleyner A	1997	Microelectronis Reliability1997，37，6：	1
19	Alloying modiication of Sn-Ag-Cu solders by manganese and titanium显示文摘	Lin Li-wei	2009	Microelectronies Reliability2009，49，：	1
20	An application of SPRT for detecting change point in a reliability growth model显示文摘	Jain S Jain R K	1994	Microelectronies Reliability1994，34，5：	1

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