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56篇 您的检索式：期刊名="Microelectronics International"

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	题名	作者	年代	出处	被引量
1	Thermal degradation of joined thick Au and A1 elements显示文摘	BOCHENEK A BOBER B HAUFFE W	2004	Microelectronics International2004，21，1：	1
2	Chip packaging challenges-a roadmap based overview显示文摘	LONGFORD A	2005	Microelectronics International2005，22，2：	1
3	Investiga-tion on the final polishing slurry and technique of siliconsubstrate in ULSI显示文摘	Liu Yuling Zhang Kailiang Wang Fang	2003	Microelectronic Engineering Pro-ceedings of the 8th International Conference on ElectronicMaterials2003，66，14：	1
4	Rapid production of microwave packaging in Silicon-aluminium by thin-shell electroforming显示文摘	BOCKING C JACOBSON D M RENNIE A EW	2002	Microelectronics International2002，19，1：	1
5	Wire bonding of low-k devices显示文摘	ZHONG Z W	2008	Microelectronics International2008，25，3：	1
6	Reliability of wirebonds in micro-electronic packages显示文摘	van Driel W D van Silfhout R B R Zhang G Q	2008	Microelectronics International2008，，2：	1
7	Fiber-optic Displacement Sensor显示文摘	ZIVANOVIC S ELAZAR J TOMIC M	1997	IEEE International Conference on Microelectronics1997，，2：	1
8	Power Management of a Wireless Sensor Node with Solar Energy Harvesting Technology显示文摘	Kah-Yoong C Hee-Foe P Chee-Pun O etal	2012	Microelectronics International2012，29，2：	1
9	Rapid production of microware packaging in Silicon-aluminium by thin-shell electroforming显示文摘	Bocking C Jacobson D M Rermie A E W	2002	Microelectronics International2002，19，：	1
10	Delay analysis of a single voltage scaled repeater driven long interconnect显示文摘	Rajeevan Chandel Sarkar S Agarwal R P	2005	Microelectronics International2005，22，3：	1
11	Using LTCC for microsystems 显示文摘	Thelemann T Thust H Hintz M	2002	Microelectronics International2002，19，3：	1
12	Low-power wireless smart data acquisition system for monitoring pressure in medical ap- plication 显示文摘	Arshak K Jafer E Waldern D	2008	Microelectronics International2008，25，1：	1
13	Crosstalk analysis and repeater insertion in crosstalk aware coupled VLSI interconnects 显示文摘	Kaushik B K Sarkar S Aggarwal R P	2006	Microelectronics International2006，23，3：	1
14	Wire bonding using copper wire显示文摘	Zhong Z W	2009	Microelectronics International2009，，1：	1
15	The Role of Micro-Slip in Ultrasonic Bonding of Microelectronic Dimensions显示文摘	CHEN G K C	1972	International Hybrid Microelectronics Symposium1972，8，5：	1
16	Optimization of reflow soldering process for BGA packages by artificial neural network显示文摘	Lin Y Deng W Shie J	2007	Microelectronics International2007，24，2：	1
17	Temperature cycling analysis for ball grid array package using finite element analysis显示文摘	Zulkifli M N Jamal Z A Z Quadir G A	2011	Microelectronics International2011，28，1：	1
18	Rapid production of microware packaging in silicon-aluminum by thin-shell electrofor ming显示文摘	BOCKING C JACOBSON D M RENNIE A E W	2002	Microelectronics International2002，19，1：	1
19	Rapid production of microwave packaging in Silicon-aluminium by thin-shell electroforming 显示文摘	BOCKING C JACOBSON D M RENNIE A E W	2002	Microelectronics International2002，19，1：	1
20	Loop closure theory in deriving a linear and simple kinematic model for a 3 DOF parallel micro-motion system显示文摘	Yong Y K Lu Tien-Fu Handley D	2003	SPIE''s International Symposium on Microelectronics2003，12，：	1

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