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1742篇 您的检索式：期刊名="Microelectronic Reliability"

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	题名	作者	年代	出处	被引量
1	Noise as a diagnostic and prediction tool in reliability physics 显示文摘	Jevtic M M	1995	Microelectronics Reliability1995，35，：	2
2	The correlation between the low-frequency electrical noises of high-power quantum well lasers and devices surface non-radiative current 显示文摘	HU Gui-jun SHI Jia-wei ZHANG Su-mei	2002	Microelectronics Reliability2002，42，：	2
3	An improved approach and experimented results of a low-frequency noise measurement technique used for reliability estimation of diode lasers 显示文摘	SHI Jia-wei JIN En-shun MA Jing	1994	Microelectronics Reliability1994，34，1：	2
4	Light emitting diodes reliability review显示文摘	Moon-Hwan Chang Diganta Das P.V. Varde Michael Pecht	2011	Microelectronics Reliability2011，，5：	2
5	Back side optical beam induced current method for the localization of electric field enhancements in edge termination structures of power semiconductor devices 显示文摘	Soelkner G Kreutle J Quincke J	2000	Microelectronics Reliability2000，40，810：	2
6	Modem IC Packaging Trends and Their Reliability Implications显示文摘	Plieninger R Dittes M Pressel K	2006	Microelectronics Reliability2006，46，911：	1
7	Temperature profile effects in accelerated thermal cycling of SnPb and Pb-free solder joints 显示文摘	Qi Y Lam R Ghorbani H R	2006	Microelectronics Reliability2006，46，24：	1
8	Reliability Model for AI Wire Bonds subjected to Heel Crack Failures显示文摘	RAMMINGER S SELIGER N Wachutka G	2000	Microelectronics Reliability2000，40，：	1
9	Thermal reliability of gold-aluminum bonds encapsulated in bi-phenyl epoxy resin显示文摘	TOMOHIRO UNO KOHEI TATSUMI	2000	Microelectronics Reliability2000，40，1：	1
10	Board level solder joint relia- bility modeling and testing of TFBGA packages for telecom- munication applications 显示文摘	Tee T Y Ng H S Yap D	2003	Microelectronics Reliability2003，43，7：	1
11	Fuzzy states as a basis for a theory of fuzzy reliability显示文摘	Cai K Y Wen C Y Zhang M L	1993	Microelectronics and Reliability1993，33，15：	1
12	Reliability Evaluation of a Hydraulic Truck Crane Using Field Data with Fuzziness显示文摘	Huang H Z	1996	Microelectronics and Reliability1996，36，10：	1
13	Least square estimation of three parameters of a weibull estimation显示文摘	SOMAN K P MISRA K B	1992	Microelectronics and Reliability1992，32，3：	1
14	Mechanical reliability in electronic packaging显示文摘	Masazumi Amagai	2002	Microelectronics Reliability2002，42，：	1
15	Application of flexible printed circuit board (FPCB) in personal computer motherboards: Focusing on mechanical performance 显示文摘	LEONG W ABDULLAH M KHOR C	2012	Microelectronics Reliability2012，52，4：	1
16	Highly reliable processes for embedding discrete passive components into organic substrates显示文摘	Han Seo Cho Sukhyeon Cho Jihong Jo Haenam Seo Byongmoon Kim Jegwang Yoo	2008	Microelectronics Reliability2008，，5：	1
17	Design of metal interconnects for stretchable electronic circuits 显示文摘	GONZALEZ M AXISA F BULCKE M V	2008	Microelectronics Reliability2008，48，6：	1
18	Time-series models for reliability evaluation of power systems including wind energy显示文摘	Billinton R Chen H Ghajar R	1996	Microelectronics Reliability1996，36，9：	1
19	Incomplete ionization in a semiconductor and its implications to device modeling显示文摘	Xiao G Lee J Liou J J	1999	Microelectronics and Reliability1999，39，8：	1
20	Experiment and numerical approach on junction temperature of high- power LED 显示文摘	LIU D J YANG H Y YANG P	2014	Microelectronics Reliability2014，54，5：	1

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