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10篇 您的检索式：期刊名="IEEE Transactions on Advanced Packaging Technology"

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		题名	作者	年代	出处	被引量
	1	Numerical simulation of the drop impact response of a portable electronic product显示文摘	Teo Y M Shim V P W	2002	IEEE Transactions on Advanced Packaging Technology2002，25，3：	1
	2	Effect of intermetallic compounds on the thermal fatigue of surface mount solder joints显示文摘	Tu P L Chan Y C Lai J K L	1997	IEEE Transactions on Components Packaging and Manufacturing Technology Part B: Advanced Packaging1997，20，1：	1
	3	Characterization of embedded passives using mac- romodels in LTCC technology显示文摘	KWANG LIM CHOI NANJU NA SWAMINATHAN M	1998	Components Packaging and Manufacturing Technology Part B: Advanced Packaging IEEE Transactions on1998，21，3：	1
	4	The effect of the oxidation of Cu-base leadframe on the interface adhesion between Cu metal and epoxy molding compound 显示文摘	CHO S J PAIK K W K1M Y G	1997	IEEE Transactions on Components Packaging and Manufacturing Technology Part B: Advanced Packaging1997，20，2：	1
	5	Modeling and experimental studies on thermosonic flip-chip bonding 显示文摘	Kang Sa-Yoon Willams Paul M	1995	IEEE Transactions on Components Packaging and Manufacturing Technology Part B: Advanced Packaging (S 1070-9894)1995，18，4：	1
	6	Thermosonic flip-chip bonding using longitudinal ultrasonic vibration显示文摘	TAN Q ZHANG W BRIAN S	1998	IEEE Transactions on Components Packaging and Manufacturing Technology Part B: Advanced Packaging1998，21，1：	1
	7	Effect of intermetallic compounds on the thermal fatigue of surface mount solder joints显示文摘	TU P L CHAN Y C LAI J K L	1997	IEEE Transactions on Components Packaging and Manufacturing Technology Part B: Advanced Packaging1997，20，1：	1
	8	Dynamic response of a rectangular plate to a shock load, with application to portable electronic products显示文摘	Suhir E Burke R	1994	Components Packaging and Manufacturing Technology Part B: Advanced Packaging IEEE Transactions on1994，17，3：	1
	9	High Q - factor inductors integrated on MCM Si substrates 显示文摘	Zu Larry Lu Yicheng Frye Robert C	1996	IEEE Transactions on Components Packaging and Manufacturing Technology Part B: Advanced Packaging1996，19，3：	1
	10	Thermosonic bonding of an optical transceiver based on an 8 * 8 vertical cavity surface emitting laser array显示文摘	Mclaren T S Kang S Y Zhang W	1997	IEEE Transactions on Components Packaging and Manufacturing Technology Part B: Advanced Packaging1997，20，2：	1

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