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75篇 您的检索式：期刊名="IEEE Trans Compon Packag Technology"

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	题名	作者	年代	出处	被引量
1	A novel current limitation principle based on application of liquid metals显示文摘	NIAYESH K TEPPER J KONIG F	2006	IEEE Trans on Components and Packaging Technology2006，29，2：	1
2	Vacuum heated electroless nickel plated contacts 显示文摘	DERVOS C T VASSILIOU P NOVAKOVIC J	2004	IEEE Trans Compon Packag Technology2004，27，1：	1
3	Prognostics and Health Management of Electronics显示文摘	Vichare N Pecht M	2006	IEEE Trans on Components and Packaging Technologies2006，29，1：	1
4	Dynamics of ultrasonic transducer system in thermosonic flip chip bonding显示文摘	LONG Z L WU Y X HAN L	2009	IEEE Trans on Components & Packaging Technologies2009，32，2：	1
5	An Investigation of the sensitivity of embedded passive component tempera- tures to PCB structure显示文摘	Stubbs D M Pulko S H Wilkinson A J	2002	IEEE Trans on Components and Packaging Technologies2002，25，4：	1
6	Computer vision for automatic inspection of complex metal patterns on multichip modules (MCM-D)显示文摘	Scaman M E Economikos L	1995	IEEE Trans on Components Packaging and Manufacturing Technology Part B:Advanced Packaging1995，18，4：	1
7	Review and summary of a silicon micro machined gas chromatography system显示文摘	KOLESAR E S RESTON R R	1998	IEEE Trans on Components Packaging and Manufacturing Technology1998，41，3：	1
8	A Life Consumption Monitoring Methodology for Electronic Systems显示文摘	Ramakrishnan A Pecht M	2003	IEEE Trans on Components and Packaging Technologies2003，26，3：	1
9	Computer vision for automatic inspection of a high density grid of pads on multi-chip modules (MCM-D)显示文摘	Seaman M E Economikos L Lambright J	1994	IEEE Trans on Components Packaging and Manufacturing Technology Part B:Advanced Packaging1994，17，3：	1
10	Experimental and nu- merical investigation into the influence of printed circuitboard construction on component operating temperature in natural convection显示文摘	Lohan J Tiilikka P Rodgers P	2002	IEEE Trans on Components and Packaging Technology2002，23，3：	1
11	High Frequency Response of Amorphous Tantalum Oxide Thin Film 显示文摘	Jin-Young Kim Garg A Rymaszewski E J	2001	IEEE Trans Components and Packaging Technologies2001，24，3：	1
12	The influence of arc chamber wall materi- al on arc gap dielectric recovery voltage 显示文摘	SHEA J J	2001	IEEE Trans on Components and Packaging Technologies2001，24，3：	1
13	Improvements in index alignment method for laserfiber array packaging显示文摘	COHEN M S DEFRANZA M J CANORA F J	1994	IEEE Trans on Components Packaging and Manufacturing Technology Part B1994，17，3：	1
14	Development of liquid cooling techniques for flip chip ball grid array packages with high heat flux dissipations显示文摘	ZHANG H Y PINJALA D WONG T N	2005	IEEE Trans Components and Packaging Technology2005，28，1：	1
15	Power and life exten- sion of battery/ultracapacitor hybrids 显示文摘	Dougal R A Liu S Y White R E	2002	IEEE Trans on Components and Packaging Technologies2002，25，1：	1
16	The effect of power cycling on the reliability of a head-free surface mount assemblies显示文摘	Davitt E Stam F A Barrett J	2001	IEEE Trans on Components and Packaging Technologies2001，24，2：	1
17	Thermal characterization of electronic devices by means of boundary condition independent compact models显示文摘	LASANCE C J M VINKE H ROSTEN H	1995	IEEE Trans on Components Packaging and manufacturing Technology1995，18，4：	1
18	Optimum design and selection of heat sinks显示文摘	LEE S	1995	IEEE Trans on Components Packaging and Manufacturing Technology Part A1995，8，4：	1
19	Electronic part life cycle concepts and obsolescence forecasting显示文摘	SOLOMON R SANDBORN P A PECHT M G	2000	IEEE Trans on Components and Packaging Technologies2000，23，4：	1
20	Power and life exten- sion of battery-ultracapacitor hybrid显示文摘	Dougal R A Liu S Y White R E	2002	IEEE Trans on Components and Packaging Technologies2002，25，1：	1

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