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97篇 您的检索式:期刊名="IEDM"
    题名 作者 年代 出处 被引量
1OUM- A180 nm nonvolatile memory cell element technology for stand- alone and embedded applications 显示文摘Lai S Lowery T 2001IEEE IEDM Technical Digest2001,5,:1
2Si complementary single-electron inverter显示文摘Ono Y Takahashi Y Nagase M 1999IEDM1999,15,:1
3A novel FET type ferroeleetric memories with excellent date retention characteristics 显示文摘YOON S M ISHIWARA H 2000IEDM Technical Digest2000,13,6:1
4Heat transfer and power capabilities of EHF helix TWTs显示文摘R Harper M P Puri 1986IEDM1986,,:1
5100W 18 - 40GHz Traveling Wave Tube显示文摘B Braatz G Dohler G Groshart 1987IEDM1987,,:1
6显示文摘Aberg I Ni Chleirigh C Olubuyide O O 2004IEDM Tech Dig2004,,:1
7The impact of the transient response of organic light emitting diodes on the de sign o{ active matrix OLED displays显示文摘Dawson R M A Shen Z Furst D A 1998IEDM Technology Digest1998,32,6:1
8Capacitance Modeling of Laterally Non-uniform MOS de-vices显示文摘A C T Aarts R van der Hod J C J Paasschens 2004IEDM2004,,:1
9High-performance infrared thermal imaging with monolithic silicon focal planes operating at room temperature 显示文摘Wood R A 1993IEEE on IEDM1993,,:1
10ALD HfO using heavy water (D2O) for improved MOSFET stability 显示文摘TSENG H H RAMON ME HEBEBT L 2003IEDM Tech Dig2003,78,12:1
11Control of phase and gain deviation in an octave bandwidth EHF TWT显示文摘 Puri M P 1986IEDM IEEE1986,19,5:1
12显示文摘Zorinsky E J Spratt D B Virkus R L 1986J IEDM1986,86,:1
13Highly performant double gate MOS-FET realized with SON process显示文摘Harrison S MA Dong-sheng 2003IEDM TD2003,3,2:1
14Performance limits in visible and infrared imager sensors显示文摘Kozlowski Luo J Tomasini A 1999IEEE IEDM Digest1999,99,:1
15Self-aligned top and bottom metal double gate low temperature poly- Si TFT fabricated at 550℃ on non - alkali glass substrate by using DPSS CW laser lateral crystallization method 显示文摘A Hara M Takei K Yoshino 2003IEEE IEDM2003,03,:1
16Highly performant double gate MOS-FET realized with SON process显示文摘Harrison S Pierreux D Terhorst H 2003IEDM TD2003,2,6:1
17High voltage thin layer device ( Resurf device) 显示文摘APPLES J A VAES H M J 1979IEDM Tech Dig1979,,:1
18Integration of (Ba, Sr)TiO3 capacitor with platinum electrodes having SiO2 spacer 显示文摘BYOUNG T L KI H L CHEOL S H 1997IEDM1997,97,:1
19Thermally robust high-quality HfN-HfO2 gate stack for advanced CMOS devices显示文摘Yu H Y Kang J F 2003IEDM Tech Dig2003,,:1
20Thermal Propertiesand Power Capability of Helix Structures for M0illimeterWaves显示文摘Sauseng O Manoly A E Hall A 1978IEDM1978,24,:1
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