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	题名	作者	年代	出处	被引量
1	Materials characterization, conduction development and curing effects on reliability of isotropically conductive adhesives显示文摘	Klosterman D Li Li	1998	IEEE Trans Compon Packg Manuf Tech1998，21，1：	2
2	Reliability issue of replacing solder with conductive adhesives in powder modules 显示文摘	Rusanen Outi Lenkker Jaako	1995	IEEE Trans Compon Packg Manuf Tech1995，18，2：	2
3	Micromechatronics and the miniaturization of structures, devices, and systems, Components, Packaging, and Manufacturing Technology(Part C)显示文摘	Friedrich CR Fang J Warrington RO	1997	IEEE Transactions on Components Hybrids and Manufacturing Technology1997，20，：	2
4	Reliability investigations on conductive adhesive joints with emphasis on the mechanics of the conduction mechanism显示文摘	Dudek R Berek H	2000	IEEE Trans Compon Packg Manuf Tech2000，23，3：	2
5	Evaluation of contact resistance for isotropic electrically conductive adhesives 显示文摘	Gaynes M A Lewis R H	1995	IEEE Trans Compon Packg Manuf Tech Part B1995，18，3：	2
6	Reliability assessment of isotropically conductive adhesive joints in surface mount applications 显示文摘	Rorgren R S Liu J	1995	IEEE Trans Compon Packg Manuf Tech1995，18，2：	2
7	A new approach to using anisotropically conductive adhesives for flip-chip assembly显示文摘	Lyons A M Hall E Wong Y H	1996	IEEE Trans Compon Packg Manuf Techn Part A1996，19，1：	2
8	A study of lubricants on silver flakes for microelectronicsconductive adhesive 显示文摘	Lu D Tong Q K Wong C P	1999	IEEE Trans Compon Packg Manuf Tech Part A1999，22，3：	2
9	Development of high conductive lead(Pb)-free conducting adhesives显示文摘	Kang S K Rai R S	1998	IEEE Trans Compon Packg Manuf Tech1998，21，1：	2
10	Study of isotropically conductive bondings filled with aggregates of nano-sized Ag-particles显示文摘	Kotthous S Gunther B H	1997	IEEE Trans Compon Packg Manuf Tech Part A1997，20，1：	2
11	Aspects of modeling of high voltage ferroelectric nonlinear ceramic capacitors 显示文摘	CAMPBELL C K VANWYK J D HOLM M F K	1992	IEEE Trans Compon Hydirds Manuf Technol1992，15，2：	2
12	Relaxation effects in high-voltage barium titanate non-linear ceramic disk capacitors 显示文摘	CAMPBELL C K VANWYK J D HOLM M F K	1993	IEEE Trans Compon Hydirds Manuf Technol1993，16，4：	2
13	A UML-based Test Model for Component Integration Test显示文摘	Choi B J Yoon H J Jeon J O	1999	Workshop on Software Atchitecture and Component1999，，12：	1
14	Ultra-wideband bandpass filter with hybrid mierostrip/CPW structure显示文摘	Wang H Zhu L Menzel W	2005	IEEE Microw Wireless Compon Lett2005，15，12：	1
15	Errors associated with the design,calibration and application of piezoresistive stress sensors in(100)silicon 显示文摘		1994	IEEE Trans Components Packaging Manufacturing Technol1994，，：	1
16	Electrical conduction models for isotropically conductive adhesive joints显示文摘	MORRIS J E	1997	IEEE Transactions on Components Package Manufacturing Technology1997，20，1：	1
17	A new ultra-widebond ultra-short monocycle pulse generator with reduced ringing显示文摘	CAN NGUYEN	2002	IEEE Microwave and Wirelcss Components Letters2002，12，6：	1
18	Analysis of Shaft Voltages and Circulating Currents in the Parallel-Connected Windings in Large Synchronous Generator显示文摘	Jean-Eric Torlay		Electric Power Components and Systems0，2002，：	1
19	Isothermal and thermal cycling aging on IMC growth rate in lead-free and lead-based solder Interface显示文摘	XU L H PANG J H L PRAKASH K H	2005	IEEE Transactions on Components and Packaging Technology2005，28，3：	1
20	Criteria for the Assessment of Reliability Models显示文摘	MICHAEL G P ANAND A S	1997	IEEE Transaction on Components1997，20，3：	1

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