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215篇 您的检索式：期刊名="IEEE Transactions on Components Package Manufacturing Technology"

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	题名	作者	年代	出处	被引量
1	Electrical conduction models for isotropically conductive adhesive joints显示文摘	MORRIS J E	1997	IEEE Transactions on Components Package Manufacturing Technology1997，20，1：	1
2	Mechanism of electrical con- duction though anisotropically conductive adhesive films 显示文摘	Mizuno M Saka M Abe H	1996	IEEE Transactions on Components Packaging and Manufacturing Technology Part A1996，19，4：	1
3	Influence of microstructure on dielectric strength of Cu-Cr contact materials in vacuum显示文摘	Ding B J Yang Z Wang X	1996	IEEE Transactions on Components Packaging and Manufacturing Technology A1996，19，10：	1
4	Effect of Surface Roughness on Paper Substrate Circuit Board显示文摘	Ryan A and Lewis H	2012	IEEE Transactions on Components Packaging and Manufacturing Technology2012，2，7：	1
5	Nondestructive detection of defects in miniatur- ized multilayer ceramic capacitors using digital speckle correlation techniques 显示文摘	Chan Y C Yeung F Jin G	1995	Components Packaging and Manufacturing Technology Part A IEEE Transactions on1995，18，3：	1
6	A structured approach for analysis of design processes显示文摘	ANDREW Kusiak JUITE Wang DAVID W He	1995	IEEE Transactions on Components Packaging and Manufacturing Technology(Part A)1995，18，3：	1
7	Development of conductive adhesive materials for via fill applications 显示文摘	Kang S K Buchwalter S L LaBianca N C	2001	Components and Packaging Technologies IEEE Transactions on [ see also Components Packaging and Manufacturing Technology Part A: Packaging Technologies IEEE Transactions on]2001，24，3：	1
8	Efficient reduced-order modeling of frequency-dependent coupling inductances associated with 3 D interconnect structures显示文摘	Silveira L M White J	1996	IEEE Transactions on Components Packaging and Manufacturing Technology1996，19，2：	1
9	New Wilkinson Power Dividers and Their Integration Applications to Four-Way and Filtering Dividers显示文摘	Deng Puhua Chen Yuta	2014	IEEE Transactions on Components Packaging and Manufacturing Technology2014，4，11：	1
10	Multiorder arnoldi approach for model order reduction of PEEC models with retardation显示文摘	RASEKH E DOUNAVIS A	2012	IEEE Transactions on Components Packaging and Manufacturing Technology2012，2，10：	1
11	Application of Path Integrals in Modeling Trans- mission Line Loss 显示文摘	RUBIN L M	1996	IEEE Transactions on Components Packaging and Manufacturing Technology1996，19，4：	1
12	Theoretical-study of factors influencing arc erosion of cathode显示文摘	Zhou X Heberlein J Pfender E	1994	IEEE Transactions on Components Packaging and Manufacturing Technology Part A1994，17，1：	1
13	Prognostics and health management of electronics显示文摘	VICHARE N PECHT M	2006	IEEE Transactions on Components Packaging and Manufacturing Technology2006，，1：	1
14	Effect of intermetallic compounds on the thermal fatigue of surface mount solder joints显示文摘	Tu P L Chan Y C Lai J K L	1997	IEEE Transactions on Components Packaging and Manufacturing Technology Part B: Advanced Packaging1997，20，1：	1
15	Thermosonic bonding of an optical transceiver based on an 8 * 8 vertical cavity surface emitting laser array显示文摘	McLaren T S Kang S Y Zhang W	1997	IEEE Transactions on Components Packaging and Manufacturing Technology Part B:Advanced Packaging1997，20，2：	1
16	Pre-bond and post-bond test and signal recovery structure to characterize and repair TSV defect induced signal degradation in 3D system显示文摘	CHO M LIU CH KIM D H	2011	IEEE Transactions on Components Packaging and Manufacturing Technology2011，5，11：	1
17	Artificial neural network in manufacturing:concepts,applications,and perspectives显示文摘	Zhang H C	1994	IEEE Transaction on Components Packaging and Manufacturing Technology1994，17，2：	1
18	Physical and Chemi- cal Properties of Metal Oxide Additions to Ag-SnO2 Con- tact Materials and Predictions of Electrical Performance显示文摘	Jearmot D Pinard J Ramoni P	1994	Components Packaging and Manufacturing Technology Part A IEEE Transactions on1994，17，1：	1
19	Artificial neural network in manufacturing:concepts,applications,and perspectives显示文摘	Huang S H Zhang H C	1994	IEEE Transaction on Components Packaging and Manufacturing Technology1994，17，2：	1
20	Estimating tools to support multipath ability in electronics manufacturing显示文摘	GRAVES R J AGRAWAL A HABERLE K	1996	IEEE Transactions on Components Packaging and Manufacturing Technology1996，19，1：	1

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