维普期刊资源整合服务平台（V6.5）

410篇 您的检索式：期刊名="Advanced Packaging"

选中清除导出查看参考文献查看引证文献引用追踪共21页首页上一页第1页下一页末页 /21 跳转

	题名	作者	年代	出处	被引量
1	Modeling of simultaneous switching noise in high speed systems显示文摘	Chun S Swaminathan M	2001	IEEE Transactions on Advanced Packaging2001，24，2：	1
2	Frequency-dependent crosstalk simulation for on-chip interconnections 显示文摘	Deutsch A Smith H H	1999	IEEE Trans Advanced Packaging1999，22，3：	1
3	Thermal and Electroless deposition of copper on poly (Tetrafluoroethylene-co-hexafluoropropylene) films modified by surface graft copolymerization显示文摘	Yang G H Neoh K G	2002	Transactions on Advanced Packaging2002，25，3：	1
4	Power Distribution Networks for System on Package: Status and Challenges 显示文摘	Swaminathan M Kim J Novak 1	2004	IEEE Transactions on Advanced Packaging2004，27，2：	1
5	Direct fabrication of electric components on insulated boards by laser micro-cladding electronic pastes显示文摘	Li X Y Li H L	2006	IEEE transactions on advanced packaging2006，29，2：	1
6	Numerical simulation of the drop impact response of a portable electronic product显示文摘	Teo Y M Shim V P W	2002	IEEE Transactions on Advanced Packaging Technology2002，25，3：	1
7	Optoelectronic and microwave transmission characteristics of indium solder bumps for low-temperature flip-chip applications 显示文摘	Kun-Mo Chu	2006	IEEE Transactions on Advanced Packaging2006，29，3：	1
8	A flexible time-stepping scheme for hybrid field-circuit simulation based on the extended time-simulation based on the extended time- domain finite method 显示文摘	Wang Rui Jin Jianming	2010	IEEE Transactions on Advanced Packaging2010，33，4：	1
9	Optical investigation of mini heat pipe arrays with sharp angled triangular grooves 显示文摘	Schneider M Yoshida M Groll M	1999	ASME Advanced in Electronic Packaging1999，12，：	1
10	Chip-level vacuum packaging of micromachines using nanogetters显示文摘	Sparks D R Massoud-Ansari S Najafi N	2003	IEEE Transactions on Advanced Packaging2003，26，3：	1
11	Thermal fatigue of SnPb and SAC resistor joints:analysis of stress-strain as a function of cycle parameters显示文摘	Qi Y Ghorbani H R Speh J K	2006	IEEE Transactions on Advanced Packaging2006，29，4：	1
12	Full-wave Solver for Microstrip Trace and through-hole Via in Layered Media显示文摘	ONG C TSANG L	2008	IEEE Transaction on Advanced Packaging2008，31，8：	1
13	Chip-package Co-implementation of a Triple DES Processor 显示文摘	Glaser S T Franzon A	2004	IEEE Transactions on Advance Packaging2004，27，1：	1
14	Effect of intermetallic compounds on the thermal fatigue of surface mount solder joints显示文摘	Tu P L Chan Y C Lai J K L	1997	IEEE Transactions on Components Packaging and Manufacturing Technology Part B: Advanced Packaging1997，20，1：	1
15	An innovative for packaging power electronics building blocks using metal posts interconnected parallel plate structures显示文摘	Kun X Lin R L	1999	IEEE Transactions on Advanced Packaging1999，22，2：	1
16	Efficient computation of interconnect capacitances using the domain decomposition approach显示文摘	V V Veremey R Mittra	1999	IEEE Transactions on Advanced Packaging1999，22，3：	1
17	A Two - body Formulation for Solder Joint Shape Prediction 显示文摘	Renken F P	1997	Advances in Electronic Packaging1997，2，：	1
18	Estimating Lifetime of Soldered Joints of QFP Leads显示文摘	Nagatake M	1997	Advances in Electronic Packaging1997，2，：	1
19	Passivity Check of S-Parameter Descriptor Systems Via S-Parameter Generalized Hamiltonian Methods显示文摘	Zhang Z Lei C U Wong N	2010	IEEE Trans on Advanced Packaging2010，33，4：	1
20	Electrical characterization of textile transmission lines显示文摘	COTTET D GRZYB J TRSTER K	2003	Advanced Packaging IEEE Transactions on2003，26，2：	1

返回顶部每页显示：

共21页首页上一页第1页下一页末页 /21 跳转

互联网出版许可证新出网证(渝)字10号全国400电话 - 免长途话费

用户提示