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		题名	作者	年代	出处	被引量
	1	Effect of particle size on thermo-physical properties of SiC_p/Cu composites fabricated by squeeze casting显示文摘For the electronic packaging applications, copper matrix composites reinforced with different sized SiC particles (10 μm, 20 μm and 63 μm) were fabricated by squeeze casting technology. And the effect of particle size on their thermo-physical properties was discussed. The composites are free of porosity and the SiC particles are distributed uniformly in the composites. It is found that the mean linear thermal expansion coefficients(20100 ℃) of SiCp/Cu composites are in the range of (8.49.2)×10-6/℃, and smaller expansion coefficient can be obtained for the composites with finer SiC particles because of the larger restriction in expansion through interfaces. Their thermal conductivities are reduced with the decrease of SiC sizes. This is attributed to the fact that the negative effect of interfacial thermal resistance becomes increasingly dominant as the particles becomes smaller.	武高辉陈国钦朱德志张强姜龙涛	2005	中国有色金属学会会刊:英文版2005，15，2：	2

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