| 6 | Effect of Lanthanum on Driving Force for Cu_6Sn_5 Growth and Improvement of Solder Joint Reliability显示文摘By means of adding low content of rare earth element La into Sn60 Pb40 solder alloy, the growth of Cu 6Sn 5 intermetallic compound at the interface of solder joint is hindered, and the thermal fatigue life of solder joint is increased by 2 times. The results of thermodynamic calculation based on diffusion kinetics show that, the driving force for Cu 6Sn 5 growth is lowered by adding small content of La in Sn60 Pb40 solder alloy. Meanwhile, there is an effective local mole fraction range of La, in which, 0 18% is the limited value and 0 08% is the best value. | 马鑫 钱乙余 YoshidaF | 2002 | Journal of Rare Earths2002，20，2： | 0 |
您所在的机构暂未开通此部分的功能，请联系管理员