| 2 | Temperature-dependent deformation in silver-particle-covered copper nanowires by molecular dynamics simulation显示文摘Cu nanowires covered by Ag particles is studied for potential applications in the next-generation microelectronics.To date,the deformation mechanism in the Cu-Ag core-particle is not clear.Here,molecular dynamics simulation is used to describe the Cu-Ag core-particle system.The results show that the equilibrium structure of Ag particles is reconstructed,when the particle≤1.0 nm.At low temperature(1 K)indicate that three different deformation processes take part in the core-particle structure,depending on the size of Ag particles.When the particle diameter≤2.0 nm,the prevailing deformation mechanism is the emission of dislocations from the Cu surface.For the particle diameters ranging from 3.0 to 6.0 nm,the emission of misfit dislocations from the Ag-Cu interface is the dominant deformation mechanism.If the Ag particle≥6.0 nm,the deformation mechanism can be characterized by the slip band,consisting of the dislocations and amorphous atoms.For elevated temperatures(2-400 K),the mechanical properties of the Ag-Cu core-shell system are nearly independent of temperature,whereas the structure with particles larger than 2.0 nm showed a strong dependence of its mechanical properties on temperature.Based on the results,the diameter-temperature plastic deformation map is proposed. | Pengtao Li Y.Q.Yang Vladimir Koval Xian Luo Jianxin Chen Wei Zhang E.Emily Lin Bowen Wang Haixue Yan | 2022 | Journal of Materiomics2022，8，1： | 0 |
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