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3篇 您的检索式：作者名="M.Saka"

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		题名	作者	年代	出处	被引量
	1	Long‐term outcome after proximal gastrectomy with jejunal interposition for suspected early cancer in the upper third of the stomach显示文摘	H.Katai S.Morita M.Saka H.Taniguchi T.Fukagawa	2010	Br J Surg2010，，4：	2
	2	Measurement of electrical conductivity of micron-scale metallic wires显示文摘Electrical conductivities of micron-scale aluminum wires were quantitatively measured by a four-point atomic force microscope (AFM) probe. This technique is a combination of the principles of the four-point probe method and standard AFM. This technique was applied to the 99.999% aluminum wires with 350 nm thickness and different widths of 5.0, 25.0 and 50.0μm. Since the small dimensions of the wires, the geometrical effects were discussed in details. Experiment results show that the four-point AFM probe is mechanically flexible and robust. The four-point AFM probe technique is capable of measuring surface topography together with local electrical conductivity simultaneously. The repeatable measurements indicate that this technique could be used for fast in-situ electrical properties characterization of sensors and microelectromechanical system devices.	M.SAKA	2006	中国有色金属学会会刊:英文版2006，16，B02：	1
	3	A technique utilizing chemical reagents for direct measurement of temperature at a local area and its engineering applications显示文摘Temperature is one of the physical quantitiesthrough which quantitative evaluation of the safety and reli-ability of industrial products can be achieved,and this hasbeen used widely in practice.Under any environmental con-dition,regardless of the size of the object to be inspected,accurate and reliable measurement of temperature is of greatpractical importance.This review article presents a simpleand direct method of temperature measurement,that can beapplied to the local areas with difficulty in measuring the tem-perature by using normal thermometers.In the present article,two different application examples are demonstrated.Oneaddresses the study of the electromigration of solders whichare used as bonding metals in electronic devices(micro-struc-tures).The application of the method to the shaft of a motorused in heavy industrial fields is explained as the second.	M.Saka T.Hasegawa	2009	Acta Mechanica Sinica2009，25，2：	0

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