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12篇 您的检索式:作者名="Kwork T"
    题名 作者 年代 出处 被引量
1A novel incremental principal component analysis and its application for face recognition显示文摘Zhao H T Yuen P C Kwork J 2006IEEE Transactions on Systems Man and Cybernetics Part B(Cybernetics)2006,36,4:1
2Acute application of noninvasive positive pressure ventilation显示文摘Liesching T Kwork H Hilln S 2003Chest2003,124,2:1
3Multidimensional vector regression for accurate and low-cost location estimation in pervasive computing显示文摘PAN J J KWORK J T YANG Qiang 2006IEEE Trans on Knowledge and Data Engineering2006,18,9:1
4High - throughput screening of small molecules for bioactivity and target identification in Caenorhabditis elegans 显示文摘BURNS A R KWORK T C HOWARD A 2006Nat Protoc2006,1,4:1
5The Evidence Framework Applied to Support Vector Machines 显示文摘KWORK J T 2000IEEE Transactions on Neural Networks2000,11,5:1
6NF-KB activation and potentia- tion of proinflammtory responses by the Helicobacter pylori CagA pro- tein 显示文摘Brandt S Kwork T Hartig R 2005P Natl Acad Sci USA2005,102,26:1
7Pole-zero tracking frequency compensation for low dropout regulator显示文摘Kwork K C Mok P K T 2002IEEE International Symposium on Circuits and Systems2002,4,:1
8Microstructure and corrosion behavior of laser surface-melted high-speed steels 显示文摘KWORK C T CHENG F T MAN H C 2007Surface and Coating Technology2007,202,2:1
9Generalized core vector machines显示文摘Tsang I W Kwork J T Zurada J M 2006IEEE Trans on Neural Network2006,17,5:1
10Acute applications of noninvasive positive pressure ventilation 显示文摘Liesching T Kwork H Hill NS 2003Chest2003,124,2:1
11The evidence framework applied to support vector machines显示文摘Kwork J T Y 2000IEEE Transactions on Neural Networks2000,11,5:1
12Thermal stress-induced and electromigration-induced void-open failures in Al and Al-Cu fine lines显示文摘KWORK T CHAN K K CHAN H 1991J Vac Sci Technol1991,9,4:1
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