维普中文期刊产品整合服务
2篇 您的检索式:作者名="J.Z.Fan"
    题名 作者 年代 出处 被引量
1Future Physics Programme of BESⅢ显示文摘There has recently been a dramatic renewal of interest in hadron spectroscopy and charm physics. This renaissance has been driven in part by the discovery of a plethora of charmonium-like XYZ states at BESⅢ and B factories, and the observation of an intriguing proton-antiproton threshold enhancement and the possibly related X(1835) meson state at BESⅢ, as well as the threshold measurements of charm mesons and charm baryons. We present a detailed survey of the important topics in tau-charm physics and hadron physics that can be further explored at BESⅢ during the remaining operation period of BEPCⅡ. This survey will help in the optimization of the data-taking plan over the coming years, and provides physics motivation for the possible upgrade of BEPCⅡ to higher luminosity.M.Ablikim M.N.Achasov P.Adlarson S.Ahmed M.Albrecht M.Alekseev A.Amoroso F.F.An Q.An Y.Bai O.Bakina R.Baldini Ferroli Y.Ban K.Begzsuren J.V.Bennett N.Berger M.Bertani D.Bettoni F.Bianchi J Biernat J.Bloms I.Boyko R.A.Briere L.Calibbi H.Cai X.Cai A.Calcaterra G.F.Cao N.Cao S.A.Cetin J.Chai J.F.Chang W.L.Chang J.Charles G.Chelkov Chen G.Chen H.S.Chen J.C.Chen M.L.Chen S.J.Chen Y.B.Chen H.Y.Cheng W.Cheng G.Cibinetto F.Cossio X.F.Cui H.L.Dai J.P.Dai X.C.Dai A.Dbeyssi D.Dedovich Z.Y.Deng A.Denig Denysenko M.Destefanis S.Descotes-Genon F.De Mori Y.Ding C.Dong J.Dong L.Y.Dong M.Y.Dong Z.L.Dou S.X.Du S.I.Eidelman J.Z.Fan J.Fang S.S.Fang Y.Fang R.Farinelli L.Fava F.Feldbauer G.Felici C.Q.Feng M.Fritsch C.D.Fu Y.Fu Q.Gao X.L.Gao Y.Gao Y.Gao Y.G.Gao Z.Gao B.Garillon I.Garzia E.M.Gersabeck A.Gilman K.Goetzen L.Gong W.X.Gong W.Gradl M.Greco L.M.Gu M.H.Gu Y.T.Gu A.Q.Guo F.K.Guo L.B.Guo R.P.Guo Y.P.Guo A.Guskov S.Han X.Q.Hao F.A.Harris K.L.He F.H.Heinsius T.Held Y.K.Heng Y.R.Hou Z.L.Hou H.M.Hu J.F.Hu T.Hu Y.Hu G.S.Huang J.S.Huang X.T.Huang X.Z.Huang Z.L.Huang N.Huesken T.Hussain W.Ikegami Andersson W.Imoehl M.Irshad Q.Ji Q.P.Ji X.B.Ji X.L.Ji H.L.Jiang X.S.Jiang X.Y.Jiang J.B.Jiao Z.Jiao D.P.Jin S.Jin Y.Jin T.Johansson N.Kalantar-Nayestanaki X.S.Kang R.Kappert M.Kavatsyuk B.C.Ke I.K.Keshk T.Khan A.Khoukaz P.Kiese R.Kiuchi R.Kliemt L.Koch O.B.Kolcu B.Kopf M.Kuemmel M.Kuessner A.Kupsc M.Kurth M.G.Kurth W.Kuhn J.S.Lange P.Larin L.Lavezzi H.Leithoff T.Lenz C.Li Cheng Li D.M.Li F.Li F.Y.Li G.Li H.B.Li H.J.Li J.C.Li J.W.Li Ke Li L.K.Li Lei Li P.L.Li P.R.Li Q.Y.Li W.D.Li W.G.Li X.H.Li X.L.Li X.N.Li X.Q.Li Z.B.Li H.Liang H.Liang Y.F.Liang Y.T.Liang G.R.Liao L.Z.Liao J.Libby C.X.Lin D.X.Lin Y.J.Lin B.Liu B.J.Liu C.X.Liu D.Liu D.Y.Liu F.H.Liu Fang Liu Feng Liu H.B.Liu H.M.Liu Huanhuan Liu Huihui Liu J.B.Liu J.Y.Liu K.Y.Liu Ke Liu Q.Liu S.B.Liu T.Liu X.Liu X.Y.Liu Y.B.Liu Z.A.Liu Zhiqing Liu Y.F.Long X.C.Lou H.J.Lu J.D.Lu J.G.Lu Y.Lu Y.P.Lu C.L.Luo M.X.Luo P.W.Luo T.Luo X.L.Luo S.Lusso X.R.Lyu F.C.Ma H.L.Ma L.L.Ma M.M.Ma Q.M.Ma X.N.Ma X.X.Ma X.Y.Ma Y.M.Ma F.E.Maas M.Maggiora S.Maldaner S.Malde Q.A.Malik A.Mangoni Y.J.Mao Z.P.Mao S.Marcello Z.X.Meng J.G.Messchendorp G.Mezzadri J.Min T.J.Min R.E.Mitchell X.H.Mo Y.J.Mo C.Morales Morales N.Yu.Muchnoi H.Muramatsu A.Mustafa S.Nakhoul Y.Nefedov F.Nerling I.B.Nikolaev Z.Ning S.Nisar S.L.Niu S.L.Olsen Q.Ouyang S.Pacetti Y.Pan M.Papenbrock P.Patteri M.Pelizaeus H.P.Peng K.Peters A.A.Petrov J.Pettersson J.L.Ping R.G.Ping A.Pitka R.Poling V.Prasad M.Qi T.Y.Qi S.Qian C.F.Qiao N.Qin X.P.Qin X.S.Qin Z.H.Qin J.F.Qiu S.Q.Qu K.H.Rashid C.F.Redmer M.Richter M.Ripka A.Rivetti V.Rodin M.Rolo G.Rong J.L.Rosner Ch.Rosner M.Rump A.Sarantsev M.Savrie K.Schoenning W.Shan X.Y.Shan M.Shao C.P.Shen P.X.Shen X.Y.Shen H.Y.Sheng X.Shi X.D Shi J.J.Song Q.Q.Song X.Y.Song S.Sosio C.Sowa S.Spataro F.F.Sui G.X.Sun J.F.Sun L.Sun S.S.Sun X.H.Sun Y.J.Sun Y.K Sun Y.Z.Sun Z.J.Sun Z.T.Sun Y.T Tan C.J.Tang G.Y.Tang X.Tang V.Thoren B.Tsednee I.Uman B.Wang B.L.Wang C.W.Wang D.Y.Wang H.H.Wang K.Wang L.L.Wang L.S.Wang M.Wang M.Z.Wang Wang Meng P.L.Wang R.M.Wang W.P.Wang X.Wang X.F.Wang X.L.Wang Y.Wang Y.F.Wang Z.Wang Z.G.Wang Z.Y.Wang Zongyuan Wang T.Weber D.H.Wei P.Weidenkaff H.W.Wen S.P.Wen U.Wiedner G.Wilkinson M.Wolke L.H.Wu L.J.Wu Z.Wu L.Xia Y.Xia S.Y.Xiao Y.J.Xiao Z.J.Xiao Y.G.Xie Y.H.Xie T.Y.Xing X.A.Xiong Q.L.Xiu G.F.Xu L.Xu Q.J.Xu W.Xu X.P.Xu F.Yan L.Yan W.B.Yan W.C.Yan Y.H.Yan H.J.Yang H.X.Yang L.Yang R.X.Yang S.L.Yang Y.H.Yang Y.X.Yang Yifan Yang Z.Q.Yang M.Ye M.H.Ye J.H.Yin Z.Y.You B.X.Yu C.X.Yu J.S.Yu C.Z.Yuan X.Q.Yuan Y.Yuan A.Yuncu A.A.Zafar Y.Zeng B.X.Zhang B.Y.Zhang C.C.Zhang D.H.Zhang H.H.Zhang H.Y.Zhang J.Zhang J.L.Zhang J.Q.Zhang J.W.Zhang J.Y.Zhang J.Z.Zhang K.Zhang L.Zhang S.F.Zhang T.J.Zhang X.Y.Zhang Y.Zhang Y.H.Zhang Y.T.Zhang Yang Zhang Yao Zhang Yi Zhang Yu Zhang Z.H.Zhang Z.P.Zhang Z.Q.Zhang Z.Y.Zhang G.Zhao J.W.Zhao J.Y.Zhao J.Z.Zhao Lei Zhao Ling Zhao M.G.Zhao Q.Zhao S.J.Zhao T.C.Zhao Y.B.Zhao Z.G.Zhao A.Zhemchugov B.Zheng J.P.Zheng Y.Zheng Y.H.Zheng B.Zhong L.Zhou L.P.Zhou Q.Zhou X.Zhou X.K.Zhou Xingyu Zhou Xiaoyu Zhou Xu Zhou A.N.Zhu J.Zhu J.Zhu K.Zhu K.J.Zhu S.H.Zhu W.J.Zhu X.L.Zhu Y.C.Zhu Y.S.Zhu Z.A.Zhu J.Zhuang B.S.Zou J.H.Zou 2020Chinese Physics C2020,44,4:517
2Mechanical Properties of a Low-thermal-expansion Aluminum/Silicon Composite Produced by Powder Metallurgy显示文摘Al matrix composite containing high volume fraction silicon has been promising candidate for lightweight and low-thermal-expansion components.Whereas,optimization of its mechanical properties still is an open challenge.In this article,a flexile powder metallurgy processing was used to produce a fully dense Al—4.0Cu(wt%) alloy composite reinforced with 65 vol.%Si particles.In this composite,Si particles were homogenously distributed,and the particle size was refined to the range of 3—15 μm.Tensile and flexural strength of the composite were 282 and 455 MPa,respectively,about 100%and 50%higher than the best properties reported in literature.The measured fracture toughness of the composite was 4.90 MPa m^(1/2).The improved strength of 65%Si/AI was attributed to the optimized particle characteristics and matrix properties.This investigation is expected to provide a primary understanding of the mechanical behaviors of Si/AI composites,and also promote the structural applications of this low-thermal-expansion material.Y.Q.Liu S.H.Wei J.Z.Fan Z.L.Ma T.Zuo 2014Journal of Materials Science & Technology2014,30,4:8
返回顶部 每页显示:
共1页 首页 上一页 第1页 下一页 末页 /1 跳转

网站首页 | 关于我们 | 联系我们 | 产品服务 | 客服中心 | 广告服务 | 版权声明 | 网站联盟 | 友情链接 | 售卡网点

版权所有© 渝B2-20050021-1 渝公网安备 50019002500403号 违法和不良信息举报中心

互联网出版许可证 新出网证(渝)字10号 全国400电话 - 免长途话费