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138篇 您的检索式：作者名="Inasaki"

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	题名	作者	年代	出处	被引量
1	Grinding Monitoring System Based on Power and Acoustic Emission Sensors显示文摘	B. Karpuschewski M. Wehmeier I. Inasaki	2000	CIRP Annals - Manufacturing Technology2000，，1：	2
2	Grinding of hard and brittle materials显示文摘	Inasaki I	1987	Annals of the CIRP1987，36，2：	2
3	Tribological Characteristics and Cutting Performance of Iubricant Esters for Semi--dry Machining显示文摘	Wakabayashi T Inasaki I Suda S	2003	CIRP Annals- Manufacturing Technology2003，52，1：	1
4	Application of acoustic emission sensor for monitoring machining processes显示文摘	Ichiro Inasaki	1998	Ultrasonics1998，36，：	1
5	Dry machining and minimum quantity lubrication 显示文摘	Weinert K Inasaki I Sutherland J W	2004	CIRP AnnalsManulhcturing Technology2004，53，2：	1
6	Molecular dynamics simulation for abrasive processes 显示文摘	Inasaki I	1994	Annals of the CIRP1994，43，1：	1
7	Dry Machining and Minimum Quantity Lubrication 显示文摘	Weinert K Inasaki I Sutherland J W	2004	Annals of the CIRP2004，53，2：	1
8	Analysis of generating motion for five axis machining centers显示文摘	SAKAMOTO S INASAKI I	1993	Transactions of the Japan Society of Mechanical Engineers1993，59，561：	1
9	Abrasive Machining of Silicon 显示文摘	Tonshoff H K Schmieden W Inasaki I	1990	CIRP Annals -- Manufacturing Technology1990，39，2：	1
10	Tribological Characteristics and Cutting Performance of Lubricant Esters for Semi-dry Ma chining显示文摘	Wakabayashi T Inasaki I Suda S	2003	CIRP Annals -Manufacturing Technology2003，52，1：	1
11	Modelling and Sim- ulation of Grinding Processes 显示文摘	Tonshoff H K Peters J Inasaki I	1992	CIRP Annals-Manufac- turing Technology1992，41，2：	1
12	Tribological action and optimal performance: research activities regarding MQL machining fluids 显示文摘	Wakabayashi T Inasaki I Suda S	2006	Journal of Machining Science and Technology Special Issue on Environmentally Con- scious Machining2006，10，1：	1
13	Polishing and Ultraprecision Machining of Semiconducter Substrate Materials显示文摘	Inasaki I Toenshoff H K Nakagawa T and Marinescu I D	1995	Annals of the1995，44，2：	1
14	Dry machi- ning and minimum quantity lubrication 显示文摘	Weinert K Inasaki I Sutherland J W	2004	CIRP An- nals-Manufacturing Technology2004，53，2：	1
15	Grinding Chatter- Origin and Suppression 显示文摘	Inasaki I Karpuschewski B Lee H S	2001	CIRP Annals- Manufacturing Technology2001，50，2：	1
16	Grinding of hard and brittle materials 显示文摘	Inasaki I	1987	Annals of the CIRP1987，36，2：	1
17	Molecular dynamics simulation for abrasive processes显示文摘	Rentsh R Inasaki I	1994	Annalsof the CIRP1994，43，1：	1
18	Abrasive machining of silicon显示文摘	Tonshoff H K Schmieden W V Inasaki I	1990	Annals CIRP1990，39，2：	1
19	Abrasive Machining in the Future 显示文摘	Inasaki I Tonshoff H K Howes T D	1988	Annals of the CIRP1988，37，2：	1
20	Tool condition monitoring (TCM)--the status of research and industrial application 显示文摘	G Byrne D Dornfeld I Inasaki	1995	CIRP1995，44，2：	1

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