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23篇 您的检索式：作者名="Harringa"

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	题名	作者	年代	出处	被引量
1	Suppression of void coalescence in thermal aging of tin-silver-copper-X solder joints显示文摘	Anderson I E Harringa J L		0，，01：	1
2	The preparation of SiGe thermoelectric materials by mechanical mlloying显示文摘	Cook B A Beaudry B J Harringa W J	1989	Institute of Electrical and Electronics Engineers1989，89，3：	1
3	Observations of nucleation catalysis effects during solidification of SnAgCuX solder joints显示文摘	Dr. I. E. Anderson J. Walleser J. L. Harringa	2007	JOM2007，，7：	1
4	Application of hot isostaticpressing for consolidation of n-type silicon–germaniumalloys prepared by mechanical alloying显示文摘	Harringa J L Cook B A	1999	MaterialsScience and Engineering: B1999，60，2：	1
5	Parasitic effectsof oxygen on the thermoelectric properties of Si80Ge20doped with GaP and P显示文摘	Cook B A Harringa J L Han S H	1992	Journal of applied physics1992，72，4：	1
6	Application of hot isostaticpressing for consolidation of n-type silicon–germaniumalloys prepared by mechanical alloying显示文摘	Harringa J L Cook B A	1999	MaterialsScience and Engineering: B1999，60，2：	1
7	Sn-Ag-Cu solders and solder joints : alloy development, microstructure, and proper- ties显示文摘	Anderson I E Cook B A Harringa J L	2002	JOM Journal of the Minerals Metals and Materials So- ciety2002，54，6：	1
8	Microstructural modifications and properties of Sn-Ag-Cu solder joints induced by alloying 显示文摘	Anderson I E Cook B A Harringa J	2002	J Electro Mater2002，31，11：	1
9	Sn-Ag-Cu solders and solder joints:Alloy Development,microstructure,and properties显示文摘	Anderson I E Cook B A Harringa J L	2002	JOM2002，54，6：	1
10	Microstructural modifications and properties of Sn-Ag-Cu solder joints induced by alloying显示文摘	ANDERSON IE COOK BA HARRINGA J	2002	J Electron Mater2002，31，11：	1
11	Sn-Ag-Cu solders and solder joints alloy development ,microstructure and properties显示文摘	Anderson I E Cook B A Harringa J L	2002	J Mater2002，，：	1
12	Coefficient of thermal expansion of A1MgB14 显示文摘	RUSSELL A M COOK B A HARRINGA J L	2002	Seripta Materialia2002，46，9：	1
13	Develop ment of Sn-Ag Cu-X solders for electronic assembly by micro-al- loying with Al显示文摘	BOESENBERG A ANDERSON I HARRINGA J	2012	Journal of Electronic Materials2012，41，7：	1
14	Application of hot isostatic pressing for consolidation of n-type silicon-germanium alloys prepared by mechanical alloying显示文摘	HARRINGA J L COOK B A	1999	Materials Science and Engineering B1999，60，2：	1
15	A new class of ultra-hard materials based on AlMgB14显示文摘	Cook B A Harringa J L Lewis T L	2000	Ser Mater2000，42，：	1
16	Sn-Ag- Cu solders and solder joints: alloy development, microstructure, and properties 显示文摘	Anderson I E Cook B A Harringa J	2002	J Electron Mater2002，31，11：	1
17	Erosion resistance of TiBrZrB2 composite显示文摘	Peter J S Cook B A Harringa J L	2009	Wear2009，267，4：	1
18	A new class of ultra-hard materials based on A1MgB14 显示文摘	Cook B A Harringa J L Lewis T L	2000	Scripta Material2000，42，6：	1
19	Alloying effects in near-eutectic Sn-Ag-Cu solder alloys for improved microstructural stability显示文摘	I. E. Anderson J. C. Foley B. A. Cook J. Harringa R. L. Terpstra O. Unal	2001	Journal of Electronic Materials2001，，9：	1
20	Sn-Ag-Cu solders and solder joints: alloy development, microstructure, and properties 显示文摘	Anderson I E Cook B A Harringa J L	2002	JOM2002，6，：	1

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